Solid-State Image Pickup Device Thermal Management
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Solution Overview
Problem
Conventional solid-state imaging apparatuses face challenges with heat dissipation and electromagnetic shielding, leading to potential image quality degradation and component malfunction due to increased heat generation and electromagnetic interference, which hinders miniaturization and reliability.
Innovation Solution
A solid-state imaging apparatus design featuring a heat dissipation plate sandwiched between two cases, made of thermally conductive materials like metal or graphite, which efficiently dissipates heat from signal processing and power supply circuits while providing electromagnetic shielding without the need for fastening members, thereby improving thermal conductivity and reducing component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional imaging apparatus design is used with separate components (lens, semiconductor imaging element, LSI) formed into cases and combined, then the device can be assembled with standard components, but the overall device size cannot be sufficiently miniaturized and heat dissipation efficiency is poor
Solution Approach 1:
The patent merges the lens holder and shield case into a single integrated component. The lens holder serves dual functions: holding the lens assembly and acting as the shield case for electromagnetic shielding and heat dissipation. This integration eliminates the need for separate cases and reduces overall device volume while improving heat dissipation efficiency through direct thermal conduction paths.
Solution Approach 2:
The lens holder is designed to perform multiple functions simultaneously: mechanical support for the lens, electromagnetic shielding for electronic components, and heat dissipation for the semiconductor imaging element. This multi-functionality reduces the number of separate components needed, enabling miniaturization while maintaining or improving thermal management performance.
2Temperature
If heat dissipating members are added to suppress heat generation, then heat dissipation improves, but the device complexity and component count increase
Solution Approach 1:
The shield case is integrated with the lens holder, eliminating the need for separate heat dissipating members. The integrated structure uses the lens holder itself as the heat dissipation path, conducting heat from the semiconductor imaging element through direct contact to the external environment, thereby reducing component count while maintaining effective heat dissipation.
Solution Approach 2:
The lens holder serves as a multi-functional component that simultaneously provides mechanical support, electromagnetic shielding, and heat dissipation. By making the lens holder universal, the patent eliminates the need for additional dedicated heat dissipating members, reducing device complexity while achieving effective thermal management.
3Reliability
If electromagnetic shielding members are disposed to prevent malfunction, then electromagnetic interference protection improves, but the device size increases and miniaturization is impeded
Solution Approach 1:
The shield case is merged with the lens holder into a single integrated component. This integration allows the electromagnetic shielding function to be provided by the lens holder structure itself, eliminating the need for separate shielding members and thereby reducing overall device volume while maintaining effective electromagnetic interference protection.
Solution Approach 2:
The lens holder is designed as a universal component that simultaneously provides mechanical support, electromagnetic shielding, and heat dissipation. By making the lens holder multi-functional, the patent achieves effective electromagnetic shielding without adding separate shielding members that would increase device size, thus enabling miniaturization.
4Temperature
If heat is conducted along the case to dissipate it, then heat dissipation occurs, but the lens temperature rises causing surface coating cracks and image quality degradation
Solution Approach 1:
The patent segments the heat dissipation paths by providing dedicated thermal conduction paths from the semiconductor imaging element to the lens holder and shield case, separate from the optical path. This segmentation ensures that heat is conducted away from the lens through structured thermal paths rather than being conducted along the case to the lens, preventing lens temperature rise and surface coating cracks.
Solution Approach 2:
The lens holder acts as an intermediary component that provides a dedicated heat dissipation path between the semiconductor imaging element and the external environment. By introducing this intermediary with high thermal conductivity, heat is efficiently conducted away from sensitive components including the lens, preventing temperature-related damage while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature rises in critical components, prevents lens cracking, and ensures reliable operation by enhancing heat dissipation and electromagnetic shielding, thus improving image quality and reducing the risk of component malfunction.
Implementation Method 1
heat dissipation plate which is thermally in contact with at least one of the electronic components... heat generated by an imaging element is conducted to the shield case through the first heat dissipating member, and further conducted to the case through the second heat dissipating member to be dissipated to the outside
Implementation Method 2
disposition of an electromagnetic shielding member in the power supplying circuit... When electromagnetic waves reach the circuits, there is a case where the circuits malfunction
Data Source
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AI summary
A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided. The solid-state imaging apparatus includes: an MCM board 41 on which a sensor 42, and a SiP 44 that processes an output signal from the sensor 42 are mounted; a power supply board 61 on which a power supply IC 62 is mounted; and a shielding section 50 which is placed between the MCM board 41 and the power supply board 61 to cover the power supply IC 62, and which has an electrically conductive property and a thermally conductive property.