Image Pickup Apparatus Substrate Connection via Vacant Space

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Solution Overview

Problem

Conventional image pickup apparatuses face challenges in size reduction and assembly due to the need for bending substrates to connect inner leads to bonding pads, which can lead to damage and complexity in manufacturing.

Innovation Solution

The image pickup apparatus features a vacant space portion on the second main surface allowing the connection electrode to be exposed, enabling direct electrical connection to the substrate without bending, thus reducing the size and improving assembly workability by maintaining the substrate within the image pickup device's outer shape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the substrate is bent to connect inner leads to bonding pads, then electrical connection is achieved, but substrate damage occurs and manufacturing complexity increases

Engineering Contradiction:

Improvesubstrate integrityVSAvoidassembly workability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Instead of bending the substrate to achieve electrical connection, the patent inverts the approach by creating a vacant space that allows the connection electrode to be exposed and connected directly to the substrate without bending. This eliminates the harmful bending action while maintaining the electrical connection function.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts the connection electrode from the conventional position on the distal end surface and relocates it to be exposed through a vacant space on the second main surface. This extraction allows the substrate to remain flat while achieving the necessary electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

2Volume of moving object

If the substrate is bent along the bottom or side surface, then the apparatus size is reduced, but the substrate is subjected to stress and damage risk

Engineering Contradiction:

Improveapparatus sizeVSAvoidsubstrate strength

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent inverts the conventional approach by not bending the substrate at all. Instead, it creates a vacant space that accommodates the connection electrode exposure, allowing the substrate to remain in its original position without stress-inducing bending while still achieving compact apparatus design.

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If the connection electrode is positioned on the distal end surface, then electrical connection is achieved, but the apparatus size increases due to substrate extension

Engineering Contradiction:

Improveelectrical connectionVSAvoidapparatus size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent transitions the connection electrode from the conventional two-dimensional position on the distal end surface to a three-dimensional configuration where it is exposed through a vacant space on the second main surface. This dimensional change allows electrical connection while maintaining compact apparatus size.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10015375B2Image pickup apparatus and endoscope including the same

Publication Date: 2018.07.03 OLYMPUS CORPORATION(JP)

AI summary

An image pickup device including a vacant space portion that allows a connection electrode to be exposed to a second main surface side, the vacant space portion being formed at a position overlapping at least the connection electrode in a state where the image pickup device is viewed in plan view from a thickness direction A, and the connection electrode exposed to the second main surface side is electrically connected with a substrate at a position in the vacant space portion, the position overlapping the image pickup device in the state where the image pickup device is viewed in plan view from the thickness direction.