Image Pickup Device Wiring Inversion for Optical Sensitivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image pickup devices face challenges in improving optical efficiency due to shading effects from wiring layers and difficulties in packaging, particularly in forming electrodes and connecting them to external substrates without increasing installation space.
Innovation Solution
The image pickup device features a sensor substrate with wiring layers below the image sensors, a support substrate with buried contact electrodes for electrical connection, and a lens layer with microlenses, enabling modularization and reduced installation space through surface mount technology, eliminating the need for external wires and allowing for a wafer level package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring layers are formed above the image sensors to construct electric circuits, then electrical connection is achieved, but the wiring layers intercept incidence light and reduce optical sensitivity
Solution Approach 1:
The patent inverts the conventional structure by forming the interlayer insulating film layer and wiring layers below the image sensors instead of above them. This inversion allows light to reach the image sensors without being intercepted by metallic wiring layers, while electrical connections are maintained through the buried wiring structure. The support substrate with contact electrodes further enables electrical connection without requiring wiring above the optical path.
Solution Approach 2:
The patent transitions from a planar arrangement where wiring and sensors share the same horizontal plane to a three-dimensional structure where wiring layers are embedded in the vertical dimension below the sensors. The support substrate with contact electrodes extends the electrical connection path vertically, allowing both optical and electrical functions to coexist without interference.
2Reliability
If electrode pads are formed in the peripheral circuit region and connected via wires to external substrate, then electrical connection is achieved, but installation space increases
Solution Approach 1:
The patent merges the support substrate with the contact electrodes into a single integrated component. The contact electrodes are formed directly on the support substrate, eliminating the need for separate wire connections and external electrode pads. This integration reduces the overall installation space while maintaining reliable electrical connection between the image sensors and external substrate.
Solution Approach 2:
The patent extracts the wiring function from the peripheral circuit region and integrates it into the support substrate structure. The contact electrodes on the support substrate provide direct electrical connection points, eliminating the need for separate wire bonding processes and reducing the space required for external connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances optical sensitivity and photoelectric efficiency while simplifying the manufacturing process and reducing installation space, enabling high-performance image pickup devices with improved packaging convenience.
Implementation Method 1
a lens layer having a plurality of microlenses formed within the lens layer
Data Source
AI summary
An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.