Image Pickup Wiring Layout With Perpendicular Substrates
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Solution Overview
Problem
Existing image pickup apparatuses face challenges in achieving both miniaturization and improving connection reliability of electrical wirings, as previous techniques fail to provide a robust configuration for connecting electrical substrates within the apparatus.
Innovation Solution
The apparatus employs a first electrical substrate disposed perpendicular to a second electrical substrate with a notch portion, where a first connector is mounted, and the substrate surface covers the electrical wiring to enhance connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If external connection terminals are arranged to overlap when viewed from top-and-bottom direction to achieve miniaturization, then the apparatus main body size is reduced, but the connection reliability of electrical wirings deteriorates
Solution Approach 1:
The patent transitions from two-dimensional terminal arrangement to three-dimensional stacking by positioning terminals at different heights (front surface and rear surface of the housing). This vertical stacking in the Z-direction enables miniaturization in the X-Y plane while maintaining connection reliability through the third dimension.
Solution Approach 2:
The patent embeds multiple terminal structures within the housing volume by placing connectors at different depths and heights. The first connection terminals are positioned on the front surface while second connection terminals are positioned on the rear surface, creating a nested arrangement that maximizes space utilization without increasing overall footprint.
2Device complexity
If connectors are mounted on electrical substrates without additional support structures, then device complexity is reduced, but connection reliability deteriorates due to connectors falling out
Solution Approach 1:
The patent introduces a housing structure as an intermediary element that provides mechanical support and positioning for the connectors. The housing contains recesses and positioning features that secure the connectors in place, preventing them from falling out while maintaining a relatively simple overall design.
Solution Approach 2:
The patent incorporates pre-formed positioning structures and recesses in the housing that are prepared in advance to receive and secure the connectors. These preliminary structural preparations ensure reliable connector retention without requiring complex assembly procedures or additional fastening mechanisms.
Data Source
AI summary
An image pickup apparatus that enables the miniaturization, and the improvement of the connection reliability of electrical wirings is provided. The image pickup apparatus includes a first electrical substrate, a second electrical substrate that has a notch portion, on which a first connector has been mounted along one side of the notch portion, and an electrical wiring that has been connected to the first connector. The first electrical substrate is disposed substantially perpendicular to the second electrical substrate in the notch portion, and a substrate surface of the first electrical substrate covers the electrical wiring.