Image Processing Device Memory Chip Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In image processing devices, such as digital cameras, the stacking of multiple memory chips on an LSI chip leads to heat accumulation, increased power consumption, and potential circuit malfunctions due to poor heat dissipation, especially with the growing amount of image data being processed.
Innovation Solution
An image processing device with an integrated circuit chip, a first memory chip adjacent to the integrated circuit chip, and a second memory chip stacked on the integrated circuit chip, which operates in different modes to manage data transfer and power usage, limiting the second memory chip's operation in low-data modes to reduce heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multiple memory chips are stacked on the LSI chip to increase data transfer rate and package density, then the data transfer rate and package density are improved, but heat accumulation increases and power consumption increases
Solution Approach 1:
The patent applies dynamics by making the memory chip configuration adaptive rather than static. The LSI chip dynamically selects between single-memory and dual-memory configurations based on real-time data transfer rate requirements. When high-speed transfer is needed, both stacked memory chips are activated; when lower speed suffices, only one memory chip is used, reducing heat generation and power consumption while maintaining adequate performance.
Solution Approach 2:
The patent changes the operational parameters of the memory system by adjusting the number of active memory chips based on processing requirements. The LSI chip includes control logic that monitors data transfer demands and adjusts memory chip activation accordingly, transforming the fixed dual-memory configuration into a variable configuration that optimizes the balance between performance and thermal management.
2Productivity
If multiple memory chips are stacked on the LSI chip to handle increased image data, then the processing capacity is improved, but the temperature rise is promoted and circuit malfunction may occur
Solution Approach 1:
The system dynamically adjusts memory resource allocation based on actual processing needs. The LSI chip includes control logic that monitors data transfer demands and activates only the necessary number of memory chips. This dynamic configuration ensures high processing capacity when needed while preventing excessive heat accumulation that could cause circuit malfunction, thereby maintaining system reliability.
Solution Approach 2:
The patent implements partial action by activating only one memory chip when full dual-memory capacity is not required. Instead of always operating both stacked memory chips at full capacity, the system uses partial memory resources for lower-demand tasks, reducing heat generation and power consumption while maintaining sufficient processing capacity for the current workload.
3Speed
If the second memory chip is operated continuously to maximize data transfer, then the data transfer capacity is improved, but power consumption increases due to heat generation
Solution Approach 1:
The LSI chip dynamically controls the operation of the stacked memory chip based on real-time data transfer requirements. When high-speed transfer is necessary, the second memory chip is activated to maximize capacity. When lower transfer rates suffice, the second memory chip remains inactive, significantly reducing power consumption and heat generation while maintaining adequate data transfer performance.
Solution Approach 2:
The LSI chip serves multiple functions by including both control logic for dynamic memory selection and the capability to interface with varying numbers of memory chips. This multi-functionality allows the system to adapt to different performance requirements and power constraints, optimizing the balance between data transfer capacity and power consumption based on current operational conditions.
Data Source
AI summary
An image processing device includes: an integrated circuit chip arranged on a substrate to perform processing on image data; a first memory chip arranged adjacent to the integrated circuit chip on the substrate and connected to the integrated circuit chip; and a second memory chip stacked on the integrated circuit chip and connected to the integrated circuit chip, wherein the integrated circuit chip sets, according to the processing content, any one of a plurality of operation modes including a first operation mode to operate the first memory chip and limit operation of the second memory chip, and a second operation mode to operate the first memory chip and the second memory chip.