Image Processing Device Substrate Segmentation for Thermal Isolation
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Solution Overview
Problem
Image processing devices with batteries and independent operation face challenges due to mutual interference of heat, vibration, and signals between components, affecting accuracy and reliability.
Innovation Solution
The device is structured with distinct substrates for different components, such as light receiving and emitting elements, power source circuits, and wireless communication modules, with strategic placement and fixation to minimize thermal and vibrational interference, and improve heat dissipation and maintainability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple components (light receiving element, light emitting element, power source circuit, wireless communication module) are disposed in a small casing, then the device becomes portable and compact, but mutual interference of heat, vibration, and signals occurs between components
Solution Approach 1:
The device divides components onto separate substrates (first substrate for light receiving element, second substrate for light emitting element, third substrate for power source circuit, fourth substrate for wireless communication module) to spatially segment heat sources and sensitive components, reducing mutual thermal and signal interference while maintaining compact form factor
Solution Approach 2:
The patent arranges substrates in a stacked three-dimensional configuration within the casing, utilizing the vertical dimension to separate components. This layered arrangement allows compact packaging while maintaining sufficient thermal and signal isolation between components that would be too close in a planar layout
2Ease of operation
If components are disposed in a small casing, then portability is improved, but accuracy of image processing decreases due to mutual interference
Solution Approach 1:
By segmenting components onto separate substrates, the patent isolates the light receiving element (sensitive to measurement accuracy) from heat-generating components like the power source circuit and light emitting element, thereby maintaining image processing accuracy while enabling portable operation
Solution Approach 2:
The substrates act as intermediary structures between components, providing physical separation and thermal isolation. The substrate materials and their arrangement serve as mediators that prevent harmful thermal and vibrational transmission from power sources to sensitive sensing elements
3Volume of moving object
If components are closely disposed to reduce size, then compactness is improved, but heat dissipation becomes difficult
Solution Approach 1:
The patent segments heat-generating components (power source circuit on third substrate, light emitting element on second substrate) from sensitive components, allowing dedicated thermal management pathways. This segmentation enables efficient heat dissipation from power sources without compromising the thermal environment of sensitive components
Solution Approach 2:
The stacked substrate arrangement creates vertical thermal pathways for heat dissipation. Heat can escape through the casing structure in the vertical dimension, while horizontal proximity is minimized through layering, enabling effective thermal management in a compact volume
Data Source
AI summary
An image processing device includes a light receiving element, a light emitting element, a battery, a power source circuit electrically coupled to the battery, an operation section, a wireless communication module, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power source circuit, a fourth substrate provided with the wireless communication module and the operation section, and a casing storing the first substrate, the second substrate, the third substrate, and the fourth substrate, in which the second substrate is fixed to the first substrate, and the first substrate is fixed to the casing.