Image Sensing Module Air Gap Structure for Stray Light Reduction
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Solution Overview
Problem
Conventional optical systems struggle with high reflection of non-imaging light, which affects image quality in high-end electronic devices, necessitating improvements in imaging lens structures to reduce reflection intensity.
Innovation Solution
An image sensing module with a circuit substrate, optical flat element, sensing element, and metal protrusions, featuring an air gap and anti-reflection layers with nano-ridge structures, enhances electrical connectivity and reduces stray light reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional imaging lens structures are used, then device complexity is reduced, but light reflection increases affecting image quality
Solution Approach 1:
The patent introduces an air gap between the optical flat element and circuit substrate, which converts the harmful reflection into useful anti-reflection functionality. The air gap creates optical path differences that cause destructive interference for reflected light, transforming the reflection problem into a solution that reduces glare and improves image quality.
Solution Approach 2:
The patent employs a composite structure combining optical flat element, air gap, and circuit substrate with metal protrusions. This composite design integrates multiple materials and structures to achieve both electrical connectivity through metal protrusions and optical performance through the air gap, solving both electrical and optical requirements simultaneously.
2Manufacturing precision
If anti-reflection structures are added to reduce light reflection, then image quality improves, but device complexity increases
Solution Approach 1:
The air gap structure serves multiple functions simultaneously: it provides electrical isolation between components, creates anti-reflection effects through optical interference, and enables thermal management. This multi-functionality reduces the need for separate anti-reflection coatings or structures, thereby improving image quality without proportionally increasing device complexity.
Solution Approach 2:
The air gap acts as an intermediary layer between the optical flat element and circuit substrate. This intermediary structure mediates the optical interaction by creating controlled reflection and transmission characteristics, while also providing electrical isolation and mechanical spacing, thus improving image quality without requiring direct contact between components.
3Reliability
If metal protrusions are added for electrical connectivity, then electrical connection is improved, but light reflection increases
Solution Approach 1:
The metal protrusions are strategically positioned in specific locations where they are needed for electrical connectivity, rather than covering entire surfaces. This localized approach ensures reliable electrical connection at critical points while minimizing the total metal surface area that could cause stray light reflection, thus balancing electrical reliability with optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures miniaturization, improves optical image quality, and increases signal-to-noise ratio by effectively reducing light reflection, thereby enhancing the performance of camera modules.
Implementation Method 1
at least one anti-reflection layer disposed on at least one surface at the air gap. The at least one anti-reflection layer includes a plurality of nano-ridge structures extending along a direction from the at least one surface at the air gap towards the air gap
Data Source
AI summary
An image sensing module includes a circuit substrate, an optical flat element, a sensing element, metal protrusions and an anti-reflection layer. The circuit substrate has an upper surface, a lower surface opposite to the upper surface, an opening surface connected to the upper and lower surfaces, and an opening located at the opening surface. The optical flat element is fixed on the upper surface. The sensing element is disposed on the lower surface. The opening is located between the sensing element and the optical flat element. The sensing element and the optical flat element form an air gap therebetween. The opening surface surrounds the air gap. The metal protrusions are disposed between and electrically connected to the circuit substrate and the sensing element. The anti-reflection layer is disposed on a surface at the air gap and includes nano-ridge structures extending towards the air gap and irregularly arranged.