Image Sensing Module Thickness Reduction via Segmented Support Legs
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Solution Overview
Problem
The existing image sensing modules, particularly those using CMOS technology, face challenges in reducing their overall thickness due to the stacking configuration of components which limits their integration in thinner portable devices.
Innovation Solution
The image sensing module design incorporates a light transmitting element supported by multiple support members directly above the CMOS image sensor, with a flexible substrate and opaque holder configuration that allows for reduced thickness by omitting the thickness of the light transmitting element and minimizing assembly tilt through alignment base levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light transmitting element is supported above the image sensing element by a single surrounding support body, then the structure is simplified, but the assembly tilt increases and manufacturing precision deteriorates
Solution Approach 1:
The single surrounding support body is segmented into multiple independent support legs (surrounding support leg and abutting support legs). This segmentation allows each leg to be independently positioned and aligned, reducing assembly tilt while maintaining structural simplicity. The multiple legs provide separate contact points that can be precisely aligned with alignment base levels.
Solution Approach 2:
Alignment base levels are provided on the image sensing element and light transmitting element before assembly. These pre-formed alignment features guide the positioning of support legs, ensuring precise alignment and minimizing assembly tilt during the manufacturing process.
2Strength
If the adhesive glue contacts the light transmitting element, then the bonding strength increases, but the light transmitting element becomes polluted and imaging quality deteriorates
Solution Approach 1:
The support leg structure is segmented into distinct functional zones: the surrounding support leg contacts the adhesive glue for bonding, while the abutting support legs contact only the light transmitting element's surface. This segmentation prevents adhesive contamination of the optical surface while maintaining bonding strength through the surrounding support leg.
Solution Approach 2:
The surrounding support leg acts as an intermediary that contacts the adhesive glue, preventing direct contact between the adhesive and the light transmitting element. This intermediary structure enables bonding while protecting the optical surface from pollution.
3Ease of manufacture
If the image sensing module uses traditional stacking configuration, then component assembly is simplified, but the overall thickness cannot be reduced
Solution Approach 1:
The support legs extend in the vertical dimension (thickness direction) rather than only in the horizontal plane. The surrounding support leg and abutting support legs are positioned at different vertical levels, allowing the light transmitting element to be supported closer to the image sensing element, thereby reducing overall module thickness while maintaining assembly simplicity.
4Manufacturing precision
If the bottom of support legs are separated by distance, then the light transmitting element can be properly positioned, but the structural stability decreases
Solution Approach 1:
Different portions of the support structure have different properties: the surrounding support leg provides bonding function with adhesive glue, while the abutting support legs provide positioning function by contacting the light transmitting element. This local differentiation allows precise positioning while maintaining structural stability through the combined action of multiple support legs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively decreases the overall thickness of the image sensing module, enhancing its integration in portable devices by preventing pollution of the image sensing area and improving assembly stability.
Implementation Method 1
The light transmitting element (20) is firmly fixed on the image sensing element (10) by curing the single surrounding support body
Data Source
Figure 1
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Figure 4~5
AI summary
An image sensing module (M) includes an image sensing unit (1), a light transmitting unit (2), a substrate unit (3) and lens unit (4). The image sensing unit (1) includes an image sensing element (10) having an image sensing area (100) on the top side of the image sensing element (10). The light transmitting unit (2) includes a light transmitting element (20) supported above the image sensing element (10) by a plurality of support members (21). The substrate unit (3) includes a flexible substrate (30) disposed on the image sensing element (10) and electrically connected to the image sensing element (10) through a plurality of electrical conductors (31), and the flexible substrate (30) has at least one through opening (300) for receiving the light transmitting element (20). The lens unit (4) includes an opaque holder (40) disposed on the flexible substrate (30) to cover the light transmitting element (20) and a lens assembly (41) connected to the opaque holder (40) and disposed above the light transmitting element (20).