Package-on-Package Structure for Image Sensing Chip Thickness Reduction
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Solution Overview
Problem
Conventional package-on-package structures for image sensing chips have a relatively large thickness due to the vertical stacking of flexible printed circuits and chip packages, which hinders the miniaturization of electronic products.
Innovation Solution
The package-on-package structure arranges the image sensing chip package and circuit board on the same surface of the control chip package, with the circuit board located at a lateral side of the image sensing chip package, reducing the total thickness and simplifying the structure, thereby facilitating miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible printed circuit and image sensing chip package are arranged on opposite surfaces of the control chip package in a vertical stacking structure, then the electrical connection between components is achieved, but the total thickness of the package-on-package structure becomes relatively large
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (one dimension) to a lateral arrangement where the flexible printed circuit and image sensing chip package are positioned on the same surface of the control chip package (two-dimensional layout). This dimensional change reduces the total thickness while maintaining electrical connectivity through alternative routing paths on the substrate surface.
Solution Approach 2:
The patent divides the first surface of the second substrate into distinct regions: a first region for electrical connection to the image sensing chip package and a second region for electrical connection to the circuit board. This segmentation allows independent optimization of connection paths and reduces the thickness required for vertical stacking while maintaining all necessary electrical connections.
2Volume of stationary object
If the vertical stacking structure is used to achieve three-dimensional packaging, then the packaging space is increased, but the process complexity increases
Solution Approach 1:
The patent extracts the flexible printed circuit from the vertical stacking sequence and positions it laterally on the same surface as the image sensing chip package. This extraction simplifies the manufacturing process by eliminating the need for complex multi-layer vertical alignment and bonding procedures while still achieving efficient space utilization through lateral arrangement.
3Reliability
If the circuit board is integrated into the vertical stacking structure, then the electrical connection is established, but the total thickness of the package-on-package structure increases
Solution Approach 1:
The patent merges the circuit board with the control chip package by positioning both on the same substrate surface rather than stacking them vertically. The first surface of the second substrate provides integrated mounting areas for both the image sensing chip package and the circuit board, reducing the overall package thickness while maintaining all electrical connections through the substrate's conductive pathways.
Data Source
AI summary
A package-on-package structure of an image sensing chip is provided, which includes: an image sensing chip package, a control chip package and a circuit board. The image sensing chip package and the control chip package are arranged on the same surface of the control chip package in parallel. The image sensing chip package includes a first substrate and an image sensing chip. The control chip package includes a second substrate and a control chip. A second surface of the first substrate is electrically connected to a first region of a first surface of the second substrate, and the circuit board is electrically connected to a second region of the first surface of the second substrate. A package-on-package method for a package-on-package structure is further provided.