Image-Sensing Module Active Area Protection Layer
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Solution Overview
Problem
The existing manufacturing processes for image-sensing modules face challenges in preventing dust contamination and abrasions due to the generation of dust during the manufacturing of light, thin, and small modules, which can lead to scratches and damage to the devices.
Innovation Solution
A protection layer is applied over the active areas of the photosensitive chips to isolate dust, allowing for smooth manufacturing processes without contamination, and is removed only after the processes are completed to expose the areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cleaning process with water is performed after dust contamination, then dust may be removed, but large dust particles may cause abrasions or scratches to the devices
Solution Approach 1:
A protection layer is formed over the active area before manufacturing processes that generate dust. This preliminary protective measure prevents dust from contacting the active area in the first place, eliminating the need for subsequent cleaning processes that could cause abrasions or scratches to the device surface
Solution Approach 2:
The protection layer acts as an intermediary barrier between the dust particles generated during manufacturing and the active area of the photosensitive chip. This intermediate layer prevents direct contact between harmful dust particles and the sensitive device surface, allowing manufacturing to proceed without contamination risks
2Volume of moving object
If the image-sensing module is made light, thin, short and small to comply with full screen requirements, then the module size is reduced, but dust generation increases during manufacturing
Solution Approach 1:
The protection layer is formed beforehand to cover the active area before any dust-generating manufacturing processes occur. This preliminary protective measure ensures that even as the module is miniaturized and more processing steps are required, the active area remains protected from dust contamination throughout the entire manufacturing sequence
3Ease of operation
If the protection layer is removed to expose the active area after manufacturing, then the active area becomes functional, but the manufacturing process becomes more complex
Solution Approach 1:
The protection layer is temporarily applied during manufacturing and then removed (discarded) after the manufacturing process is complete. This temporary protective measure enables the active area to become functional while the added step of removal is offset by the elimination of cleaning processes and the prevention of rework due to dust contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protection layer effectively prevents dust from reaching the active areas, reducing the risk of scratches and improving manufacturing yield, while ensuring the active areas remain clean and functional.
Implementation Method 1
the protection layer disposed in the active area of the photosensitive chip is applied to isolate the dust generated during the manufacturing process and prevent contamination from the outside
Implementation Method 2
cleaning a surface of the substrate with use of plasma
Data Source
AI summary
A manufacturing method of an image-sensing module includes following steps. A substrate is provided. At least one photosensitive chip is disposed on the substrate, and each of the at least one photosensitive chip has an active area. At least one protection layer covers the at least one active area of the at least one photosensitive chip. A first manufacturing process is performed, and dust is generated during the first manufacturing process. The at least one protection layer is suitable for isolating the dust from the at least one active area. The at least one protection layer is removed to expose the at least one active area.