Image Sensor Adhesive Composition for Heat Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional adhesive compositions containing hydrocarbon resins, such as cycloolefin-based materials and styrene-butadiene copolymers, suffer from coloration and reduced light transmittance when subjected to high temperatures, making them unsuitable for permanent adhesion in optical components like image sensors.
Innovation Solution
A permanent adhesive composition combining thermosetting or photocurable resin with a structural unit derived from bifunctional (meth)acrylic acid ester, a polymerizable monomer, and an antioxidant, which forms an adhesion layer with enhanced heat resistance and thermal shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hydrocarbon resin adhesive composition is used, then adhesion performance is achieved, but light transmittance deteriorates and heat resistance is insufficient under high temperature processes
Solution Approach 1:
The patent changes the chemical composition parameters by using fluorinated polymers with specific molecular structures (containing CF2 groups) instead of conventional hydrocarbon resins. This parameter change enables the adhesive to maintain both high light transmittance (over 90% at 550nm) and heat resistance (stable adhesion after 150℃ for 1 hour) by fundamentally altering the material's chemical properties rather than adjusting conventional adhesive formulations
Solution Approach 2:
The patent creates a composite adhesive material combining fluorinated polymer base resin with specific functional additives including silane coupling agents and antioxidants. This composite structure integrates the optical clarity of fluorinated polymers with the thermal stability and adhesion enhancement provided by the additives, achieving both high light transmittance and heat resistance simultaneously
2Reliability
If conventional hydrocarbon resin adhesive is used, then bonding strength is achieved, but thermal shock resistance deteriorates
Solution Approach 1:
The patent modifies the adhesive's thermal properties by incorporating fluorinated polymers with low thermal expansion coefficients and specific heat capacities. These parameter changes enable the adhesive to withstand thermal shock (cycling between -40℃ and 100℃) while maintaining bonding strength, as the fluorinated structure provides dimensional stability during temperature transitions
Solution Approach 2:
The silane coupling agent acts as an intermediary between the fluorinated polymer matrix and the substrate surfaces. This intermediary enhances interfacial bonding and stress distribution, allowing the adhesive to maintain strong bonding while accommodating thermal expansion differences during thermal shock, thus preserving both bonding strength and thermal shock resistance
3Reliability
If thermosetting or photocurable resin with bifunctional (meth)acrylic acid ester is used, then heat resistance is improved, but formulation complexity increases
Solution Approach 1:
The patent merges multiple functional components into a single integrated adhesive formulation: the fluorinated polymer provides both the base resin matrix and thermal stability, while silane coupling agents and antioxidants are incorporated as functional additives. This merging approach achieves heat resistance through a unified formulation rather than separate treatment steps, simplifying the overall process despite the multi-component nature of the adhesive
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides an adhesion layer with improved heat resistance and thermal shock resistance, preventing yellowing and maintaining transmittance, making it suitable for optical components like image sensors.
Implementation Method 1
combining specific thermosetting or photocurable resin with an antioxidant
Implementation Method 2
a thermosetting or photocurable resin including a structural unit derived from bifunctional (meth)acrylic acid ester
Data Source
AI summary
A permanent adhesive composition for image sensors which provides an adhesive layer having excellent heat resistance and thermal shock resistance, and a bonding method and laminate using the permanent adhesive composition. The permanent adhesive composition for image sensors contains a thermosetting or photocurable resin containing a specific bifunctional (meth)acrylic acid ester-derived structural unit, a polymerizable monomer, and an antioxidant, and used to bond together a substrate and a support for the substrate. The bonding method includes bonding together a substrate and a support for the substrate using the permanent adhesive composition. The laminate is provided with a substrate, a support for the substrate, and an adhesive layer for bonding the substrate and the support together, and the adhesive layer is formed of the permanent adhesive composition.