Image Sensor Package Adhesive Film Tilting
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Solution Overview
Problem
The existing methods for attaching image sensor chips to substrates using epoxy polymer result in reduced manufacturing yield due to tilting issues, which affect the thickness and compactness of semiconductor devices.
Innovation Solution
An image sensor package is designed with an adhesive film of equal width to the image sensor chip, having lateral surfaces coplanar with the chip, which is applied in a half-cured state and then annealed, to securely attach the chip to the substrate, reducing tilting and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid epoxy polymer is used to attach the image sensor chip to the substrate, then the chip can be attached to the substrate, but the chip tilts during attachment which reduces manufacturing yield
Solution Approach 1:
The patent changes the physical state of the adhesive from liquid (epoxy polymer) to solid (adhesive film), which fundamentally alters the attachment process. The adhesive film is provided in a half-cured state and then fully cured through annealing, transforming it from a fluid that allows chip movement to a rigid structure that prevents tilting and ensures precise, flat attachment.
Solution Approach 2:
The adhesive film is prepared in advance in a half-cured state with specific mechanical properties that facilitate chip attachment. The film's lateral surfaces are pre-formed to be coplanar with the chip's lateral surfaces, ensuring proper alignment and preventing tilting before the final curing process occurs during annealing.
2Reliability
If the adhesive film width is equal to the image sensor chip width with coplanar lateral surfaces, then tilting is reduced and yield increases, but the device complexity increases
Solution Approach 1:
The adhesive film is designed with specific local characteristics: its width exactly matches the chip width, and its lateral surfaces are coplanar with the chip's lateral surfaces. This localized precision in the adhesive film's dimensions and surface alignment ensures uniform attachment pressure and prevents tilting, directly improving manufacturing yield without requiring complex overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the adhesive film ensures secure attachment of the image sensor chip to the substrate, reducing tilting and enhancing manufacturing yield while achieving compactness and improved performance.
Implementation Method 1
applied in a half-cured state and then annealed
Data Source
AI summary
An image sensor chip includes a substrate; an image sensor chip provided on the substrate; and an adhesive film provided between the image sensor chip and the substrate in a semi-cured state. A first width of the adhesive film is equal to a second width of the image sensor chip.