Image Sensor Alignment Marks for Overlay Shift Reduction

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Solution Overview

Problem

The existing image sensor fabrication methods face challenges in achieving precise alignment between processing layers, leading to overlay shifts and misalignment issues, particularly in small pixel designs, which affect the performance and accuracy of image sensors.

Innovation Solution

The proposed solution involves forming multiple sets of alignment marks on the wafer, with each set used as a reference for specific mask layers, reducing the number of alignment transfers and thereby minimizing overlay shifts, ensuring accurate placement of pixel circuit components such as photodiodes and isolation structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple alignment transfers are performed during fabrication, then more mask layers can be processed, but overlay shifts accumulate and alignment precision deteriorates

Engineering Contradiction:
Improvenumber of mask layers processedVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent divides the alignment reference system into multiple independent sets of alignment marks (first set, second set, third set) corresponding to different mask layers. Each mask layer uses its dedicated alignment marks as reference, eliminating the need for sequential alignment transfers between marks. This segmentation of the alignment reference system allows processing multiple mask layers while maintaining consistent alignment precision for each layer.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the number of alignment marks is increased to reduce transfers, then alignment accuracy improves, but device complexity increases

Engineering Contradiction:
Improvealignment accuracyVSAvoidnumber of alignment mark sets
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Each set of alignment marks serves multiple functions: they act as alignment references for their specific mask layer, and simultaneously serve as structural references for subsequent processing steps. The alignment marks are integrated into the fabrication process flow rather than being separate added elements, allowing the same mark structures to fulfill both alignment and process coordination functions.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20230245977A1Alignment Method for Image Sensor Fabrication and Associated Semiconductor Device
Publication Date: 2023.08.03 OMNIVISION TECHNOLOGIES INC
  • US20230245977A1 patent drawing
  • US20230245977A1 patent drawing
  • US20230245977A1 patent drawing

AI summary

The present disclosure provides an alignment method for image sensor fabrication that involve forming a number of set of alignment marks using key process mask layers to improve alignment registration between process mask layers so as to reduce number of alignment transfer improves alignment accuracy between pixel elements. The present disclosure further provides a semiconductor device that includes such alignment mark structures.