Ultra-Compact Image Sensor Assembly for Thin Devices
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Solution Overview
Problem
The design of thin and compact mobile devices is hindered by larger components such as camera modules, which protrude due to their size and shape, limiting device thickness and placement options.
Innovation Solution
The implementation of an ultra-compact image sensor assembly using a multilayer printed circuit board (PCB) with an asymmetric core structure and cavity, allowing the image sensor to be mounted partially within the PCB, reducing its height and planar dimensions, and incorporating thermal vias or high conductivity regions for improved thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional camera module is used to achieve suitable optical performance, then optical performance is improved, but device thickness increases due to the protruding sensor height
Solution Approach 1:
The image sensor is nested within a cavity formed in the multilayer PCB, allowing the sensor to be partially embedded in the PCB structure. This nesting approach reduces the protruding height of the sensor assembly while maintaining the required optical performance, as the cavity provides space for the sensor body without increasing the overall device thickness.
Solution Approach 2:
The invention transitions from a conventional planar mounting approach to a three-dimensional embedded structure by forming a cavity within the multilayer PCB. This dimensional change allows the sensor to be positioned partially within the PCB volume rather than entirely on the surface, reducing the vertical profile while maintaining optical functionality.
2Length of stationary object
If the image sensor is reduced in size to enable thinner profile devices, then device thickness is reduced, but thermal management becomes more challenging
Solution Approach 1:
Thermal vias are introduced as intermediary heat transfer pathways within the multilayer PCB structure. These vias act as thermal conduits that conduct heat away from the image sensor mounted in the cavity, providing effective thermal management despite the compact integrated structure. The thermal vias bridge the thermal gap between the sensor and the PCB exterior, enabling heat dissipation.
3Ease of manufacture
If the image sensor is mounted on the PCB surface to maintain electrical connection simplicity, then ease of manufacture is improved, but planar dimensions and height increase
Solution Approach 1:
The PCB is segmented into multiple layers with a cavity formed by removing material from the interior. This segmentation allows the sensor to be mounted in the cavity space rather than on the external surface, reducing the planar footprint while maintaining manufacturing feasibility through standard multilayer PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables thinner profile devices with enhanced image sensor performance and thermal management, allowing for more flexible device design and reduced size, particularly beneficial for devices like head-mounted displays.
Implementation Method 1
the asymmetric core structure may include thermal vias or a high conductivity thermal region that extends from the interior layer to another exterior layer of the multilayer PCB. Coupled to the image sensor, these thermal vias or thermal region can sink heat through the asymmetric core structure and away from the image sensor thereby improving sensor thermal performance
Data Source
AI summary
This document describes techniques and apparatuses that implement an ultra-compact image sensor assembly. In some embodiments, a printed circuit board assembly comprises a multilayer printed circuit board (PCB) having an asymmetric core structure. A cavity extends from an exterior layer of the multilayer PCB to an exposed portion of an interior layer of the multilayer PCB. The interior layer can be formed on the asymmetric core structure or another PCB layer above the asymmetric core structure. An image sensor is mounted at least partially in the cavity and electrically connected to conductive pads embodied on the exposed portion of the interior layer of the multilayer PCB. By mounting the image sensor in the cavity, height and planar dimensions of the image sensor assembly can be reduced, thereby enabling thinner profile imaging devices.