Image Sensor Attenuation Layer Sidewall Design

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Solution Overview

Problem

Image sensors with split pixel structures face issues with high angle incident light and internal reflections that can saturate small photodiodes, affecting their sensitivity and dynamic range.

Innovation Solution

An attenuation layer is deposited on the sidewall of the buffer layer above large photodiodes and surrounding the small photodiodes, preventing high angle incident light and reflections from activating small photodiodes, while maintaining light sensitivity of large photodiodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If an attenuation layer is deposited on the sidewall of the buffer layer above large photodiodes, then the sensitivity of small photodiodes to high intensity light is improved, but the light sensitivity of large photodiodes may be reduced

Engineering Contradiction:
Improvesensitivity of small photodiodesVSAvoidlight sensitivity of large photodiodes
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The attenuation layer is selectively deposited only on the sidewalls of the buffer layer above large photodiodes, creating a localized optical attenuation structure. This local modification allows the attenuation layer to block high-angle incident light and internal reflections from reaching small photodiodes, while the large photodiodes maintain their light sensitivity through their top surfaces and central regions that are not blocked by the sidewall-only attenuation structure.

Inventive Principle:
Principle #3Local quality

2Object-generated harmful factors

If the attenuation layer covers the top surface of large photodiodes, then crosstalk to small photodiodes is reduced, but the light collection efficiency of large photodiodes decreases

Engineering Contradiction:
Improvecrosstalk to small photodiodesVSAvoidlight collection efficiency of large photodiodes
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The attenuation layer is segmented to cover only the sidewall regions of the buffer layer rather than the entire top surface. This segmentation approach divides the buffer layer surface into attenuated sidewall regions and non-attenuated top surface regions, allowing the attenuation layer to block crosstalk paths while leaving the primary light collection areas of large photodiodes exposed and functional.

Inventive Principle:
Principle #1Segmentation

3Object-affected harmful factors

If a complete attenuation layer is deposited over all photodiodes, then high angle incident light is blocked, but the overall quantum efficiency of the sensor is reduced

Engineering Contradiction:
Improvehigh angle incident lightVSAvoidquantum efficiency
Core Design Contradiction:
Object-affected harmful factorsVSMeasurement precision

Solution Approach 1:

The attenuation layer is applied locally only to sidewall regions rather than uniformly across all photodiode surfaces. This localized application blocks high-angle incident light and internal reflections that cause crosstalk, while maintaining quantum efficiency by leaving the top surfaces where primary light enters the large photodiodes completely exposed and unattenuated.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves the performance of image sensors by reducing crosstalk and saturation of small photodiodes, enhancing their sensitivity to high intensity light and maintaining the sensitivity of large photodiodes.

Implementation Method 1

An attenuation layer is deposited on the sidewall of the buffer layer above large photodiodes and surrounding the small photodiodes, preventing high angle incident light and reflections from activating small photodiodes

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS11362121B2Light attenuation layer fabrication method and structure for image sensor
Publication Date: 2022.06.14 OMNIVISION TECHNOLOGIES INC
  • US11362121B2 patent drawing
  • US11362121B2 patent drawing
  • US11362121B2 patent drawing

AI summary

An image sensor includes a substrate having a plurality of small photodiodes and a plurality of large photodiodes surrounding the small photodiodes. The substrate further includes a plurality of deep trench isolation structures in regions of the substrate between ones of the small photodiodes and the large photodiodes. Each of large photodiodes having a full well capacity larger than each of the small photodiodes. The image sensor further includes an array of color filters disposed over the substrate, a first and second buffer layer disposed between the substrate and the array of color filters, metal grid structures disposed between the color filters and above the first buffer layer, and an attenuation layer portion above a region of the substrate between ones of the large and small photodiodes, the attenuation layer portion is between the first and second buffer layers and normal to an upper surface of the substrate.