Image Sensor Barrier Structure for Crack Control
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Solution Overview
Problem
The die sawing process for manufacturing image sensors poses a risk of damaging pixels due to stress applied to the substrate, leading to potential defects and reduced reliability and productivity.
Innovation Solution
Incorporating a barrier structure in the residual scribe lane region to block crack progression during the die sawing process, thereby preventing damage to the pixels and improving the reliability and manufacturing efficiency of the image sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the scribe lane region area is reduced to increase the number of image sensors per substrate, then productivity is improved, but the risk of damaging pixels due to stress during die sawing increases
Solution Approach 1:
The substrate is divided into multiple regions including device regions and scribe lane regions. The scribe lane region is further segmented into first scribe lane regions (where cracks are blocked) and second scribe lane regions (where cracks are allowed to propagate for separation). This segmentation allows the substrate to be cut into multiple image sensors while protecting the pixel regions from crack damage.
Solution Approach 2:
The first scribe lane region acts as an intermediary barrier between the device regions. It contains barrier structures that mediate the crack propagation process by blocking cracks before they can reach the pixel regions, thus protecting the pixels while still allowing the substrate to be separated into individual sensors.
2Reliability
If barrier structures are added to block crack progression, then pixel damage risk is reduced, but device complexity increases
Solution Approach 1:
The barrier structures are localized specifically within the first scribe lane regions, which are positioned between the device regions. The device regions themselves maintain their original simple structure without additional barrier elements. This local quality approach adds protection only where needed while minimizing overall structural complexity.
Solution Approach 2:
The barrier structures are pre-formed within the substrate during the manufacturing process, before the die sawing operation. This preliminary action ensures that the protective structures are already in place to block cracks before they can propagate to the pixel regions during the cutting process, eliminating the need for additional protective measures during assembly.
Data Source
AI summary
The present disclosure provides an image sensor and a method of manufacturing the same. An image sensor includes a first substrate, a barrier structure, a first structure, a second substrate, and a second structure. The first substrate includes a device region in which unit pixels are disposed and a first residual scribe lane region surrounding the device region. The first substrate has a first surface and a second surface. The barrier structure penetrates the first substrate in the first residual scribe lane region. The first surface of the first substrate is on the first structure. The second substrate includes a second residual scribe lane region facing the first residual scribe lane region. The second substrate has a front surface and a rear surface. The second structure is on the front surface of the second substrate and faces the first surface of the first substrate. The second structure is bonded to the first structure.