Image Sensor Substrate With Bent Leads for OIS and AF Motion
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Solution Overview
Problem
Conventional camera modules require complex spring structures for optical image stabilization (OIS) and autofocus (AF) functions, which are cumbersome and difficult to manufacture, and struggle with effective camera shake correction, especially in the Z-axis direction.
Innovation Solution
An image sensor substrate with a novel lead pattern design that allows for relative movement between the image sensor and the lens barrel in X-axis, Y-axis, and Z-axis directions, simplifying the structure and eliminating the need for complex spring systems by using a bent lead pattern for connection and support, enabling stable and elastic support of the image sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex spring structure is used for OIS and AF functions, then the camera module can achieve autofocus and optical image stabilization, but the structure becomes cumbersome and difficult to manufacture
Solution Approach 1:
The patent extracts the spring structure from the camera module by implementing the image sensor substrate as a flexible printed circuit board that directly supports the image sensor. This eliminates the need for separate spring components while maintaining the required flexibility and support functions, thereby simplifying the overall structure and reducing manufacturing complexity.
Solution Approach 2:
The image sensor substrate serves multiple functions: it provides electrical connections to the image sensor, offers mechanical support, enables relative movement for OIS and AF operations, and replaces the traditional spring structure. This multi-functional design consolidates several components into one, reducing device complexity while maintaining reliability.
2Reliability
If a conventional spring structure is used for camera shake correction, then the image sensor can be supported, but the structure is cumbersome and manufacturing is difficult
Solution Approach 1:
The patent merges the support function traditionally performed by separate spring components into the image sensor substrate itself. The flexible PCB structure integrates mechanical support with electrical connectivity, eliminating the need for separate spring assembly steps and simplifying the manufacturing process.
3Reliability
If the camera module includes separate spring structures for OIS and AF, then the functions are achieved, but the device height increases
Solution Approach 1:
The patent implements a nested arrangement where the image sensor is mounted on the flexible image sensor substrate, which itself is integrated within the camera module structure. This nested configuration allows components to be space-efficiently arranged, reducing the overall device height while maintaining all required functions.
4Reliability
If complex spring structures are used for autofocus and stabilization, then the camera functions work properly, but manufacturing efficiency decreases
Solution Approach 1:
The patent segments the camera module into distinct functional layers: the image sensor substrate layer, the image sensor layer, and the lens assembly layer. This segmentation allows each component to be manufactured and prepared separately using standardized PCB and sensor mounting processes, improving manufacturing efficiency while maintaining proper assembly and function.
Data Source
AI summary
An image sensor substrate according to an embodiment includes: an insulating layer including a first open region; and a first lead pattern part disposed on the insulating layer, wherein the first lead pattern part includes: a first pattern part disposed on the insulating layer; a connection portion extending from the first pattern part; and a second pattern part connected to the first pattern part through the connection portion, wherein the second pattern part and the connection portion are disposed to fly on a region not overlapped with the insulating layer in a vertical direction.