Image Sensor Pixel Structure for Blind Pixel Noise Matching
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Solution Overview
Problem
In traditional infrared image sensor structures, the blind pixel array and the effective pixel array are not in the same environment, leading to different thermal noise levels and reduced detection sensitivity.
Innovation Solution
An image sensor structure is designed where the blind pixel structure layer and the detection structure layer are integrated into the same effective pixel, with the blind pixel structure layer being a second conductivity type non-sensitive material layer and the detection structure layer being a first conductivity type sensitive material layer, both connected to shared and separate extraction electrodes, arranged in a serpentine shape, and formed on the sidewalls of undoped fin structures to improve integration and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the blind pixel array and the pixel array are arranged in different regions, then the structure can be simplified and manufactured, but the thermal noise levels differ between arrays leading to reduced detection sensitivity
Solution Approach 1:
The patent merges the blind pixel array and the effective pixel array into the same physical region, allowing both arrays to experience identical environmental conditions and thermal noise levels. This is achieved by integrating the blind pixel structure layer and detection structure layer within the same pixel region, eliminating the thermal noise differential that occurs when arrays are separated in traditional designs.
2Measurement precision
If the blind pixel array and the pixel array are placed in the same region, then the detection sensitivity is improved through uniform environmental conditions, but the space ratio of each pixel increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked structure, placing the blind pixel structure layer and detection structure layer in different vertical dimensions within the same pixel footprint. This dimensional change allows both arrays to share the same environmental conditions while maintaining efficient use of the pixel area through vertical integration rather than horizontal expansion.
3Productivity
If the blind pixel array and the pixel array are integrated into the same effective pixel, then the chip integration is enhanced and space ratio is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the pixel structure into distinct functional layers - the blind pixel structure layer and the detection structure layer - each with specific roles. The blind pixel structure layer contains blind pixels for noise reference, while the detection structure layer contains effective pixels for signal detection. This segmentation allows for modular manufacturing processes where each layer can be fabricated and integrated systematically, reducing overall manufacturing complexity despite the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the space ratio of each pixel, enhances chip integration, and improves detection sensitivity by ensuring both arrays are in the same environment, reducing detection errors and allowing flexible adjustment of resistance.
Implementation Method 1
a detection structure layer and a blind pixel structure layer, wherein the detection structure layer adopts a first conductivity type sensitive material layer, and the blind pixel structure layer adopts a second conductivity type non-sensitive material layer
Data Source
AI summary
The present disclosure relates to an image sensor structure and a manufacturing method thereof. A detection structure layer and a blind pixel structure layer are used. The detection structure layer and the blind pixel structure layer are effectively combined and further formed by ion implantation. Thus, the space ratio of a single pixel is reduced, the integration and device sensitivity are improved, and the blind pixel array and the pixel array are also in the same environment, thereby further improving the detection sensitivity and reducing the detection error.