Image Sensor Module With Bonded Transparent Filter Chip
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Solution Overview
Problem
Conventional camera modules face issues with image sensor contamination during packaging, leading to imaging defects, and the design of the holder with the IR filter is constrained due to direct exposure of the image sensor to the ambient environment.
Innovation Solution
A method for forming an image sensor module involves attaching a first wafer with image sensor chips to a carrier wafer, forming a permanent bonding layer, and bonding a transparent filter chip with each image sensor chip, with the photosensitive region facing the transparent filter chip, allowing for protection from contaminants and a more flexible holder design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the image sensor is attached to the PCB and directly exposed to the ambient environment during packaging, then the packaging process can be simplified, but the photosensitive area becomes easily contaminated causing imaging defects
Solution Approach 1:
The patent applies preliminary action by bonding the transparent filter chip to the image sensor chip before attaching the image sensor to the PCB. This pre-assembly creates a protected structure where the photosensitive area is enclosed between the filter chip and the sensor, preventing contamination during subsequent packaging steps while maintaining manufacturing simplicity
Solution Approach 2:
The transparent filter chip serves as an intermediary element that both protects the photosensitive area from contamination and allows light transmission. By positioning this filter chip directly over the photosensitive region before PCB attachment, it acts as a protective barrier during packaging while maintaining optical functionality
2Manufacturing precision
If a holder is used to hold the IR filter and bond it with the image sensor, then the IR filter can be positioned accurately, but the design of structure and size of the holder is constrained
Solution Approach 1:
The patent merges the holder function with the transparent filter chip itself. Instead of using a separate holder structure to position and support the IR filter, the filter chip is directly bonded to the image sensor chip, integrating the positioning and support functions into the filter component. This eliminates the need for a complex holder structure while maintaining positioning accuracy through direct bonding
Solution Approach 2:
The transparent filter chip performs multiple functions: it filters infrared radiation, positions the filter accurately relative to the sensor, and provides structural support that previously required a separate holder. This multi-functionality reduces the overall device complexity while maintaining manufacturing precision
Data Source
AI summary
An image sensor module and method for forming the same are provided. A first side of a first wafer is attached to a first carrier wafer, the first wafer containing a plurality of first chips. A permanent bonding layer is formed on a second side of the first wafer. The permanent bonding layer includes at least one of a patterned bonding layer and a transparent bonding layer. A second chip is bonded with each first chip of the first wafer via the permanent bonding layer there-between. The first chip is one of an image sensor chip and a transparent filter chip, the second chip is the other of the image sensor chip and the transparent filter chip, and the image sensor chip has a photosensitive region facing the transparent filter chip.