Image Sensor Bonding Layer with Modulus Gradient for Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages do not effectively manage stress applied to image sensors, which can lead to mechanical damage during assembly and use.
Innovation Solution
A semiconductor package design featuring a bonding layer with distinct regions of different elastic moduli, where a region with a lower modulus of elasticity is positioned on the periphery of a higher modulus region, securely attaching the image sensor to the package substrate while mitigating stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform bonding layer is used to attach the image sensor to the package substrate, then the attachment is simple and manufacturing is easy, but stress applied to the image sensor cannot be effectively relieved
Solution Approach 1:
The bonding layer is divided into a first region with a first modulus of elasticity and a second region with a second modulus of elasticity that is lower than the first. This local differentiation allows the second region to specifically relieve stress applied to the image sensor while the first region provides strong attachment, resolving the contradiction between simple uniform structure and effective stress relief.
2Reliability
If a bonding layer with different modulus regions is used to relieve stress, then stress relief is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The bonding layer utilizes changes in the physical parameter of modulus of elasticity by incorporating a second region with a lower modulus than the first region. This parameter differentiation enables the bonding layer to provide both strong attachment and effective stress relief, improving image sensor protection while maintaining manufacturability through controlled material property variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces stress on the image sensor, preventing bending or inclination and ensuring secure attachment, while also facilitating heat transfer during operation.
Implementation Method 1
the bonding layer includes a first region, and a second region, wherein the second region has a modulus of elasticity lower than that of the first region, and wherein the second region is disposed on a periphery of the first region
Data Source
AI summary
A semiconductor package includes a package substrate, an image sensor disposed on the package substrate, and a bonding layer disposed between the package substrate and the image sensor, and including a first region and a second region, the second region has a modulus of elasticity lower than that of the first region and is disposed on a periphery of the first region.