Image Sensor Package Bonding Wire Protection via Support Member

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Solution Overview

Problem

Miniaturization of camera modules leads to reduced space for bonding wires, making them susceptible to breakage due to internal component interference and external impacts, compromising reliability.

Innovation Solution

An image sensor package design featuring a substrate connected by a bonding wire, a sub-housing surrounding the wire, and a support member that limits elastic deformation and protects the wire, along with a reinforcing board for enhanced rigidity and heat dissipation, and a filter to reduce module height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the camera module is miniaturized, then the size of the camera module is reduced, but the space for the bonding wire is reduced making it more susceptible to breakage

Engineering Contradiction:

Improvecamera module sizeVSAvoidbonding wire reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The bonding wire protection structure is segmented into multiple functional zones: the support member with through-hole for wire routing, the first cushioning member for shock absorption, and the second cushioning member for additional protection. This segmentation allows each component to perform its specific function optimally while maintaining overall compactness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first and second cushioning members are positioned in advance around the bonding wire path to provide shock absorption and impact protection before external forces can damage the wire. The cushioning members are pre-installed in the support member structure to mitigate potential damage from external impacts.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Ease of operation

If the bonding wire is exposed in the space between sub-housing and substrate, then the wire is accessible for electrical connection, but the wire is vulnerable to interference from internal components and external impacts

Engineering Contradiction:

Improveelectrical connection accessibilityVSAvoidbonding wire interference and impact

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The bonding wire is nested within the support member structure, which provides a protective through-hole pathway. The wire passes through the support member rather than being exposed in the open space, allowing electrical connection while protecting the wire from harmful factors. The cushioning members are nested within the support member to provide additional protection.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The support member acts as an intermediary structure between the substrate and the bonding wire, providing a protected pathway for the wire. The first and second cushioning members serve as intermediary protective elements that absorb impacts and prevent direct contact between harmful external forces and the bonding wire.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If the sub-housing is made flexible to accommodate assembly variations, then the assembly process is easier, but the sub-housing may deform under external impact causing wire breakage

Engineering Contradiction:

Improveassembly flexibilityVSAvoidsub-housing rigidity

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The support member structure provides localized rigidity at critical positions where the bonding wire passes through, while other portions of the housing structure can maintain flexibility for assembly. The through-hole and cushioning member arrangement creates a rigid protective corridor for the wire without requiring the entire sub-housing to be rigid.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11569282B2Image sensor package including bonding wire inside support member

Publication Date: 2023.01.31 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An image sensor package includes a substrate connected to an image sensor by a bonding wire; a sub-housing disposed adjacent to an upper surface of the substrate so as to surround the bonding wire; and a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing, and a portion of the bonding wire is disposed inside the support member.