Image Sensor Module Primary Secondary Camera Layout
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Solution Overview
Problem
Existing image sensor modules face challenges in combining primary high-resolution imagers and secondary imagers on the same sensor chip, where the lens barrel of the primary camera can obstruct the field-of-view of the secondary cameras, leading to incomplete depth information and increased complexity in manufacturing and installation.
Innovation Solution
Designing an image sensor module with a semiconductor chip featuring both primary and secondary cameras, where the lens barrel of the primary camera is optimized to not substantially obstruct the field-of-view of the secondary cameras, allowing for a contiguous assembly that facilitates easier installation and reduced misalignment, and incorporating processing circuitry to acquire high-resolution and depth data simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the lens barrel of the primary camera is positioned to achieve high-resolution imaging, then the primary camera's image quality is improved, but the field-of-view of the secondary cameras is obstructed
Solution Approach 1:
The patent positions the primary and secondary cameras at different lateral locations on the sensor chip, utilizing spatial dimensionality to resolve the obstruction conflict. The primary camera is positioned at a first lateral location while secondary cameras are positioned at second lateral locations, allowing each camera type to have its own optimized optical path without mutual interference.
Solution Approach 2:
The patent implements camera-specific optical optimizations at different locations on the sensor chip. Each camera type (primary and secondary) has its lens barrel and optical elements positioned and configured locally to optimize for its specific imaging requirements, with the primary camera optimized for high-resolution imaging and secondary cameras optimized for depth sensing with unobstructed field-of-view.
2Adaptability or versatility
If multiple separate camera modules are used to achieve both high-resolution imaging and depth sensing, then functional versatility is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent integrates multiple camera functions (primary high-resolution imaging and secondary depth sensing) into a single sensor chip assembly. The primary camera and one or more secondary cameras are positioned at different lateral locations on the same sensor chip, sharing common optical elements and processing circuitry, thereby reducing the number of separate modules needed and simplifying manufacturing and installation.
Solution Approach 2:
The sensor chip is designed to perform multiple functions simultaneously - high-resolution imaging through the primary camera and depth sensing through the secondary cameras. The shared optical path and processing circuitry enable the single assembly to provide both imaging and depth mapping capabilities, making the system versatile while reducing complexity.
3Adaptability or versatility
If separate sensors are used for primary and secondary cameras to achieve functional independence, then operational flexibility is improved, but alignment precision and manufacturing cost worsen
Solution Approach 1:
The patent positions both primary and secondary cameras on the same sensor chip, which inherently ensures precise alignment between the cameras and the sensor. This integrated approach eliminates the need for complex post-assembly alignment procedures that would be required if separate sensors were used, while still maintaining functional independence through separate photosensitive regions and processing paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the acquisition of high-resolution 2D and 3D images with complete depth information, reduces manufacturing costs, and simplifies installation by integrating multiple cameras into a single sensor, while maintaining the field-of-view for secondary cameras, thus enhancing image capture capabilities.
Implementation Method 1
The image sensors include pixels that generate signals in response to sensing received light
Implementation Method 2
light entering through an aperture at one end of the imaging device is directed to an image sensor by a beam shaping system (e.g., one or more passive optical elements such as lenses)
Implementation Method 3
an optical assembly that includes a band-pass filter that allows visible light, and light corresponding to the light emitted by the light source, to pass to the secondary camera
Data Source
AI summary
Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.