Image Sensor Capacitor Connection Pattern Landing Region
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image sensors face challenges in simplifying electrical connections and fabrication processes due to complex wiring structures, leading to increased resistance and inefficiencies in light reception and signal conversion.
Innovation Solution
The design incorporates a capacitor connection pattern with a landing region protruding from the capacitor region, allowing for direct connection to wiring without traversing multiple layers, reducing resistance and simplifying the fabrication process by forming a landing region that connects to adjacent electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-layer wiring structures are used in image sensors, then electrical connections can be established, but electrical resistance increases and fabrication complexity increases
Solution Approach 1:
The patent transitions from traditional planar multi-layer wiring to a three-dimensional vertical structure where the capacitor connection pattern extends downward into the substrate. The landing region protrudes from the capacitor region in the vertical dimension, allowing direct connection to underlying electrodes without requiring multiple horizontal wiring layers, thus reducing both complexity and resistance.
2Ease of manufacture
If traditional capacitor connection patterns are used, then electrical connections are established, but the fabrication process becomes complex and resistance increases
Solution Approach 1:
The landing region is formed as part of the capacitor connection pattern before final wiring deposition. This preliminary formation of the protruding landing region ensures proper alignment and direct connection to underlying electrodes, simplifying subsequent fabrication steps while guaranteeing low-resistance electrical connections.
3Productivity
If longer electrical paths are used in capacitor connections, then connections can be established, but resistance increases and light-receiving efficiency decreases
Solution Approach 1:
The invention extracts the essential connection function from the complex multi-layer wiring system by creating a direct vertical path through the landing region. This removes unnecessary intermediate connection layers and extends the connection path downward into the substrate, significantly reducing the electrical path length and associated resistance while improving light-receiving efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electrical resistance and simplifies the fabrication process, enhancing light-receiving efficiency and sensitivity in image sensors by minimizing the length of electrical paths and maintaining coplanar surfaces for improved connectivity.
Implementation Method 1
a photoelectric conversion layer in the substrate, wherein the second surface of the substrate is configured to receive incident light
Data Source
AI summary
Image sensors are provided. The image sensor may include a substrate including a first surface and a second surface opposite the first surface, a photoelectric conversion layer in the substrate, and a lower capacitor connection pattern on the first surface of the substrate. The second surface of the substrate may be configured to receive incident light. The lower capacitor connection pattern may include a capacitor region and a landing region protruding from the capacitor region. The image sensors may also include a capacitor structure including a first conductive pattern, a dielectric pattern, and a second conductive pattern sequentially stacked on the capacitor region, a first wire on the capacitor structure and connected to the second conductive pattern, and a second wire connected to the landing region. The first conductive pattern may be connected to the lower capacitor connection pattern. A surface of the first wire facing the substrate and a surface of the second wire facing the substrate may be coplanar.