Image Sensor Through-Substrate Channel Signal Delay
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Solution Overview
Problem
Conventional image sensor devices experience signal propagation delay due to the distance between the image sensor device and separate controller or image processor chips, which negatively impacts camera performance.
Innovation Solution
An image sensor device is designed with a substrate having a through-substrate channel and bond pads on the front side surface, where wire bond wires are bonded to the bond pads and extend through the channel to the back side surface, with a redistribution layer and molding layer for electrical conductivity, allowing for a more direct connection and reducing signal propagation delay.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensor device is coupled to separate controller or image processor chips, then the device functionality is complete, but signal propagation delay increases
Solution Approach 1:
The controller die or image processor die is embedded within the image sensor device package, merging previously separate functional components into a single integrated structure. This reduces the physical distance between components, thereby decreasing signal propagation delay while maintaining complete device functionality.
Solution Approach 2:
The controller die or image processor die is nested inside the image sensor device package, with the substrate having a front side surface and a back side surface, and the embedded die positioned within the package structure. This nesting arrangement minimizes the wiring path length and signal propagation delay between the image sensor and controller.
2Reliability
If wire bond wires are extended through the substrate channel, then electrical connection is achieved, but device profile increases
Solution Approach 1:
The wire bond wires are routed through a through-substrate channel that extends vertically through the substrate from the front side surface to the back side surface, utilizing the vertical dimension rather than extending wires horizontally across the device surface. This dimensional change reduces the horizontal wiring path length and enables a low-profile device structure while maintaining reliable electrical connections.
Data Source
AI summary
An image sensor device, as well as methods therefor, is disclosed. This image sensor device includes a substrate having bond pads. The substrate has a through substrate channel defined therein extending between a front side surface and a back side surface thereof. The front side surface is associated with an optically-activatable surface. The bond pads are located at or proximal to the front side surface aligned for access via the through substrate channel. Wire bond wires are bonded to the bond pads at first ends thereof extending away from the bond pads with second ends of the wire bond wires located outside of an opening of the channel at the back side surface. A molding layer is disposed along the back side surface and in the through substrate channel. A redistribution layer is in contact with the molding layer and interconnected to the second ends of the wire bond wires.