Stacked Image Sensor Wiring Substrate for Independent Chip Redesign
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Solution Overview
Problem
Existing solid-state imaging devices require redesigning both pixel and circuit chips for design changes, limiting flexibility and increasing costs due to the interdependence of their element/wiring layouts.
Innovation Solution
A stacked solid-state imaging device configuration where a connecting substrate electrically connects the pixel and circuit chips, allowing for independent design changes of one chip without altering the other, using a substrate with wiring and insulating layers to facilitate flexible design accommodations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the pixel chip and circuit chip are directly connected with interdependent layouts, then the device structure is simple, but the design flexibility is reduced and redesign costs increase
Solution Approach 1:
A connecting substrate is introduced as an intermediary component between the pixel chip and circuit chip. This connecting substrate includes a substrate body with wiring that electrically connects the pixel chip and circuit chip, allowing independent design changes of either chip without requiring coordinated redesign of both chips as in direct connection configurations.
2Adaptability or versatility
If a connecting substrate is introduced to enable independent design changes, then design flexibility is improved, but device complexity increases
Solution Approach 1:
The connecting substrate serves multiple functions: it provides electrical connection between chips through its wiring, acts as a support structure for mounting both pixel chip and circuit chip, and enables design independence between chips. This multi-functionality justifies the additional component by consolidating several roles into a single element.
Data Source
AI summary
Provided is a solid-state imaging device that readily accommodates a design change of a pixel chip or a circuit chip. The solid-state imaging device according to the present technology includes a pixel chip including a pixel having a photoelectric conversion element, at least one circuit chip including a circuit configured to process a signal generated in the pixel, and a connecting substrate electrically connecting the pixel chip and the circuit chip, in which the pixel chip, the connecting substrate, and the circuit chip are stacked in this order. It is possible to provide a solid-state imaging device that readily accommodates a design change of a pixel chip or a circuit chip on the basis of the solid-state imaging device according to the present technology.