Image Sensor Chip Height Control via Substrate Embedding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wafer level packaging methods for image sensing chips struggle to accurately control the height of the image sensing chip, leading to deviations in the distance between the chip and the lens, which affects imaging quality.
Innovation Solution
The image sensing chip is embedded in a through hole of a substrate, with its front surface flush with the substrate's surface, allowing precise control of the chip's height and ensuring a consistent distance to the lens by using a substrate with first and second contact pads and electrical connection structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the image sensing chip is secured to the substrate via adhesive in wafer level packaging, then the packaging process is simplified and productivity is improved, but the thickness of the adhesive is not well controlled, resulting in large deviation in the height of the image sensing chip and the distance between the chip and lens
Solution Approach 1:
The patent introduces a supporting layer as an intermediary component between the substrate and the image sensing chip. This supporting layer serves as a precise positioning platform that determines the height and position of the chip, while the adhesive only needs to provide basic bonding function. The supporting layer acts as a mediator that separates the positioning function from the bonding function, allowing each to be optimized independently.
Solution Approach 2:
The patent divides the packaging structure into distinct functional layers: substrate, supporting layer, adhesive layer, and image sensing chip. The supporting layer is segmented as a separate component with precise thickness control, allowing the positioning function to be independent from the adhesive bonding process. This segmentation enables the adhesive thickness to be controlled within a specific range without directly determining the chip height.
2Device complexity
If the image sensing chip is secured to the substrate via adhesive, then the packaging structure is simplified, but the distance between the image sensing chip and the lens cannot be strictly controlled, resulting in deviation from design distance
Solution Approach 1:
The supporting layer serves as an intermediary that precisely controls the distance between the substrate and the image sensing chip. By positioning the chip on top of the supporting layer, the distance from the lens to the chip is determined by the thickness of the supporting layer rather than the adhesive layer, enabling strict control of this critical dimension while maintaining a relatively simple packaging structure.
3Ease of manufacture
If conventional wafer level packaging is used, then the packaging process is easier to implement, but the imaging quality cannot be ensured due to large deviation between actual and design distance
Solution Approach 1:
The supporting layer acts as a mediator that ensures imaging quality by providing precise positioning and height control for the image sensing chip. This intermediary component allows the packaging process to remain relatively simple while achieving the strict distance control required for high-quality imaging, thus maintaining ease of manufacture while improving reliability.
Data Source
AI summary
An image sensing chip package and an image sensing chip packaging method are provided. In the image sensing chip package, an image sensing chip is located in a through hole of a substrate, and a front surface of the image sensing chip is flush with a first surface of the substrate. In this way, in the image sensing chip package, a height of the image sensing chip is controlled with the first surface of the substrate as a reference. Since the first surface of the substrate does not change in the packaging process, almost no uncontrollable factor affects the height of the image sensing chip.