Image Sensor Chip Package with Air Space and Flexible Substrate
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Solution Overview
Problem
Current image and light sensor chip packages face challenges in enhancing electrical properties while reducing manufacturing costs, particularly in protecting the sensitive chip area from contamination and moisture while maintaining efficient light sensing capabilities.
Innovation Solution
The proposed solution involves an image or light sensor chip package with a semiconductor substrate, transistors, dielectric layers, interconnection layers, and metal traces, where a metal layer is connected through an opening in an insulating layer and a polymer layer, with a transparent substrate forming an air space to enhance light sensing and electrical signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional chip packages are used to protect the photo-sensitive chip, then the chip is protected from contamination and moisture, but the electrical properties and manufacturing cost are compromised
Solution Approach 1:
The patent employs a flexible substrate instead of traditional rigid packaging materials. This flexible substrate provides protection while allowing for more efficient electrical connections and reducing manufacturing complexity. The flexible nature enables better conformability and integration with the photo-sensitive chip, improving both protection and electrical properties simultaneously.
Solution Approach 2:
The patent introduces wirebonded wires as an intermediary connection method between the chip and external circuits. This wirebonding technique provides reliable electrical connection while simplifying the manufacturing process compared to traditional packaging methods, thereby reducing manufacturing cost while maintaining protection integrity.
2Object-affected harmful factors
If protective packaging is implemented, then the chip is shielded from environmental factors, but manufacturing complexity increases
Solution Approach 1:
The patent merges the protective function and electrical connection function into a single integrated flexible substrate structure. This eliminates the need for separate protective housing and connection components, significantly reducing manufacturing complexity while maintaining environmental shielding. The unified structure simplifies assembly and reduces the number of manufacturing steps required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the electrical properties of the chip package, reduces manufacturing costs, and effectively protects the chip from contamination while maintaining efficient light sensing and signal transfer.
Implementation Method 1
The photosensitive area can be used to sense light and transfer electrical signals
Implementation Method 2
an air space is between the insulating layer and the transparent substrate and over the multiple transistors
Data Source
AI summary
An image or light sensor chip package includes an image or light sensor chip having a non-photosensitive area and a photosensitive area surrounded by the non-photosensitive area. In the photosensitive area, there are light sensors, a layer of optical or color filter array over the light sensors and microlenses over the layer of optical or color filter array. In the non-photosensitive area, there are an adhesive polymer layer and multiple metal structures having a portion in the adhesive polymer layer. A transparent substrate is formed on a top surface of the adhesive polymer layer and over the microlenses. The image or light sensor chip package also includes wirebonded wires or a flexible substrate bonded with the metal structures of the image or light sensor chip.