Image Sensor Chip Package Sealing for Compact Digital Camera Modules
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Solution Overview
Problem
Conventional digital camera modules are too large due to the need for sufficient space around the image sensor chip for wire bonding tools, making them unsuitable for slim, compact electronic devices while compromising on size and reliability.
Innovation Solution
A digital camera module design with a lens holder and image sensor chip package where the image sensor chip is sealed by an adhesive and transparent cover, minimizing the package size and reducing contamination, and using a base with pads for electrical connections without side walls to allow for compact assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sufficient space is provided around the image sensor chip for wire bonding tools, then wire bonding can be performed, but the package volume becomes much larger than the chip size
Solution Approach 1:
The patent extracts the wire bonding process requirement from the package design by providing access openings in the seal structure. This allows wire bonding tools to reach the chip pads through the openings without requiring the entire package to have large clearance space, thus enabling wire bonding while maintaining compact package volume.
Solution Approach 2:
The patent uses a seal structure with openings that can be flexibly configured to allow tool access. The seal members are designed with specific opening patterns that permit wire bonding operations while maintaining a compact overall package structure, effectively using the seal structure as a flexible barrier that selectively allows access.
2Reliability
If a frame structure with side walls is used to hold the image sensor chip, then the chip can be secured, but the package volume increases
Solution Approach 1:
The patent removes the traditional frame structure with side walls and replaces it with a seal structure that provides chip securing through adhesive bonding. The seal members are positioned to hold the chip in place without requiring the voluminous frame structure, thus achieving reliable chip securing with minimal package volume.
Solution Approach 2:
The patent replaces the mechanical frame structure with a chemical bonding system using adhesive. The adhesive layer between the seal members and the chip provides securing force, substituting the mechanical constraint of side walls with a chemical bonding mechanism, thereby reducing package volume while maintaining chip securing reliability.
3Volume of stationary object
If the image sensor chip is exposed without sealing, then the package can be small, but the chip is susceptible to contamination
Solution Approach 1:
The patent uses seal members with openings that act as a flexible barrier system. The seal structure provides selective access - it seals the chip to prevent contamination while incorporating openings that allow necessary access for wire bonding. This creates a protected environment for the chip without requiring a completely open or excessively large sealed structure.
Solution Approach 2:
The seal structure creates a protected environment around the image sensor chip, isolating it from external contamination sources. The seal members form a barrier that maintains a cleaner internal environment, effectively creating an inert or protected atmosphere for the sensitive chip components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a smaller digital camera module with improved reliability and reduced contamination of the image sensor, enhancing image quality and suitability for compact devices.
Implementation Method 1
a transparent cover (405), and an adhesive (404) positioning the transparent cover with respect to the image sensor chip (402). The adhesive (404) and the transparent cover (405) cooperatively seal the image sensor chip (402) therein
Data Source
AI summary
A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.