Image Sensor Chip Package Segmentation for Optical Quality
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Solution Overview
Problem
Image sensor chip packages face issues with light absorption, refraction, and reflection due to transparent substrates, which affect image sensing quality and hinder size reduction, while high-quality substrates are costly.
Innovation Solution
A method involving a substrate with predetermined scribe lines, a support substrate, and a spacer layer is used to form image sensor chip packages without a support substrate on the light receiving surface, allowing for dicing and reducing package size, with conducting structures and a package layer to enhance light sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a transparent substrate is used to support the image sensor chip during fabrication, then the fabrication process can be favorably performed, but the substrate absorbs, refracts, and reflects light affecting image sensing quality
Solution Approach 1:
The patent divides the substrate into multiple regions: a first substrate region that remains as part of the final package and a second substrate region that is removed after dicing. This segmentation allows the substrate to serve as a support during fabrication while enabling removal of portions that interfere with light sensing, thus resolving the contradiction between manufacturing ease and light sensing quality.
Solution Approach 2:
The patent employs a temporary support substrate that is discarded after serving its purpose during fabrication and dicing processes. The support substrate is removed after the image sensor chip is diced into individual packages, eliminating its harmful optical effects while having provided manufacturing support when needed. This temporary use and subsequent removal resolves the contradiction between needing support for fabrication and avoiding light interference in the final product.
2Ease of manufacture
If a transparent substrate is used to support the image sensor chip, then fabrication is easier, but the package size cannot be reduced further
Solution Approach 1:
The substrate is segmented into a first substrate region that forms part of the final compact package and a second substrate region that is removed. This allows the package to maintain the manufacturing advantages of substrate support while minimizing the final package volume by eliminating unnecessary substrate portions after dicing.
Solution Approach 2:
The support substrate is discarded after completing its support function during fabrication and dicing, allowing the final package to be smaller than if the entire substrate were retained. This temporary support approach enables both easy fabrication and reduced package size.
3Object-affected harmful factors
If a transparent substrate with sufficient optical quality is used, then light sensing quality is maintained, but the cost increases
Solution Approach 1:
The substrate is divided into regions with different requirements: the first substrate region maintains optical quality for light sensing, while the second substrate region (removed after dicing) can be of lower quality. This segmentation allows cost reduction in the removed portion while maintaining quality where needed, resolving the contradiction between optical quality and cost.
Solution Approach 2:
The patent uses a support substrate that does not require high optical quality since it is removed after fabrication and dicing. Only the minimal first substrate region remaining in the final package needs optical quality, significantly reducing overall material costs while maintaining light sensing performance.
Data Source
AI summary
A method for forming an image sensor chip package includes: providing a substrate having predetermined scribe lines defined thereon, wherein the predetermined scribe lines define device regions and each of the device regions has at least a device formed therein; disposing a support substrate on a first surface of the substrate; forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines; forming a package layer on a second surface of the substrate; forming conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and dicing along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.