Solid-State Image Sensor Column Signal Processing Isolation
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Solution Overview
Problem
In solid-state image sensors, the simultaneous reading of pixel signals from different colors via shared power supply and control lines leads to signal interference, causing color mixture and degradation in resolution and color reproducibility.
Innovation Solution
The implementation of separate conductive lines for power supply and control signals for column signal processing circuits that handle different color pixel signals, ensuring each color's signals are processed independently to prevent cross-interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pixel signals of multiple colors are read out during a single period using shared power supply and control lines, then the reading speed and frame rate are improved, but signal interference occurs causing color mixture
Solution Approach 1:
The patent divides the power supply lines and control lines into separate, dedicated lines for each color channel (R, G, B). Instead of sharing common lines among multiple colors, each color has its own isolated conductive paths, preventing signal interference and color mixture while maintaining high-speed reading capability
Solution Approach 2:
The patent extracts and removes the harmful common impedance coupling from the system by eliminating shared power supply and control lines. Each color channel is given independent conductive paths, taking out the source of interference (shared lines) that caused color mixture
2Manufacturing precision
If separate conductive lines are used for each color channel, then color mixture is reduced and image quality is improved, but device complexity and wiring density increase
Solution Approach 1:
The patent resolves the wiring complexity issue by transitioning from a planar two-dimensional layout to a three-dimensional structure. Conductive lines are routed through different layers and depths within the semiconductor substrate, allowing separate R, G, and B signal paths to coexist without excessive surface density while maintaining physical separation
Data Source
AI summary
A solid-state image sensor comprises a pixel array in which a plurality of pixels are two-dimensionally arranged, and a plurality of column signal processing circuits which read out signals from the pixel array via a plurality of column signal lines arranged in correspondence with respective columns of the pixel array, wherein signals of the pixels of different colors in the pixel array are read out by the plurality of column signal processing circuits during a single period, and wherein at least the column signal processing circuits which process signals of the pixels of different colors, of the plurality of column signal processing circuits, are driven via conductive lines which are separated from each other in a region where at least the column signal processing circuits which process signals of the pixels of different colors are arranged.