Image Sensor Conductive Layer Arcing Prevention

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Solution Overview

Problem

The miniaturization of semiconductor image sensor pixels increases the risk of electrical discharge arcing during manufacturing processes, leading to defects and reduced production yield due to localized charge imbalances in dielectric layers under conductive layers, particularly during plasma-enhanced processes.

Innovation Solution

A dielectric layer is formed over the conductive layer to protect it from arcing, with a protective layer deposited non-plasma-enhanced to prevent arcing and smooth the surface, and a conductive layer is designed with a grid structure in pixel regions and a concave shape in dark regions to manage charge accumulation and reduce defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If pixel size is miniaturized to increase sensor resolution, then image quality improves, but the risk of electrical discharge arcing during manufacturing increases

Engineering Contradiction:
Improveimage qualityVSAvoidmanufacturing reliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

A dielectric layer is introduced as an intermediary between the conductive layer and the plasma environment during manufacturing processes. This dielectric layer acts as a protective barrier that prevents direct interaction between plasma and the conductive layer, thereby eliminating arcing defects while allowing the miniaturized pixel structure to maintain its high resolution capabilities

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If plasma-enhanced processes are used for manufacturing, then deposition efficiency improves, but electrical discharge arcing occurs causing defects

Engineering Contradiction:
Improvedeposition efficiencyVSAvoiddefect rate
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The dielectric layer is formed in advance before subsequent plasma-enhanced manufacturing processes. This preliminary protective layer prevents arcing during later plasma deposition steps, allowing the process to maintain high deposition efficiency without generating electrical discharge defects in the final product

Inventive Principle:
Principle #10Preliminary action

3Length of moving object

If conductive layer is made thinner to reduce pixel pitch, then device size decreases, but charge accumulation and arcing risk increase

Engineering Contradiction:
Improvepixel pitchVSAvoidarcing risk
Core Design Contradiction:
Length of moving objectVSObject-affected harmful factors

Solution Approach 1:

The dielectric layer serves as a mediator that isolates the thin conductive layer from plasma environments during manufacturing. This allows the conductive layer to be made thinner to reduce pixel pitch while the dielectric layer prevents charge accumulation and arcing that would otherwise occur with thinner conductive structures

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces arcing-induced defects, improves manufacturing reliability, and increases production yield by preventing electrical discharges and smoothing the surface of the conductive layer, enhancing the overall performance and efficiency of the image sensor production process.

Implementation Method 1

a protective layer is deposited non-plasma-enhanced to prevent arcing and smooth the surface

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS10497729B2Image sensor having conductive layer and protective layer
Publication Date: 2019.12.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10497729B2 patent drawing
  • US10497729B2 patent drawing
  • US10497729B2 patent drawing

AI summary

An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.