Image Sensor Cooling With Sealed Air Circulation Conduit
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Solution Overview
Problem
Existing image capturing apparatuses face challenges in effectively dissipating heat generated from semiconductor elements without increasing the size of the device, which can lead to potential failures and safety issues due to high temperatures.
Innovation Solution
The apparatus incorporates an air circulation conduit system with a heat transfer metallic plate and intake/exhaust ports positioned on different surfaces to facilitate heat dissipation, utilizing the space typically reserved for a mechanical shutter mechanism, and ensuring the air circulation conduit is not communicated with the internal space to prevent dust ingress and maintain device integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-releasing air duct is provided between the image sensor and circuit board, then heat dissipation efficiency is improved, but the device thickness increases
Solution Approach 1:
The patent transitions from vertical heat dissipation (increasing thickness) to lateral heat dissipation (utilizing width). The air duct is configured to extend laterally from the image sensor toward the housing periphery, allowing heat to be dissipated through the side surfaces of the device rather than requiring additional thickness. This dimensional change resolves the contradiction by maintaining effective heat dissipation while keeping the device profile thin.
Solution Approach 2:
The housing structure serves multiple functions: it provides mechanical support, contains the imaging components, and acts as a heat dissipation pathway. The air duct is integrated into the housing itself, allowing the housing to simultaneously serve as both structural enclosure and thermal management system, eliminating the need for separate thick heat dissipation components.
2Temperature
If the air circulation conduit is connected to the internal space, then heat dissipation is enhanced, but dust ingress and contamination occur
Solution Approach 1:
The patent introduces an intermediary structure - the air duct - that is positioned between the internal space and the external environment. The duct includes sealed connections at both ends: one end connects to the image sensor mounting surface while the other opens to the external environment. This intermediary configuration allows heat to be conducted through the duct material while preventing direct communication between the internal space and external dust-laden air.
Solution Approach 2:
The heat dissipation pathway is extracted from the internal space volume and repositioned as a separate conduits structure. By removing the air circulation path from the internal space and positioning it laterally, the patent enables heat dissipation without creating openings in the housing that would allow dust ingress into the internal imaging environment.
3Productivity
If semiconductor elements operate at high performance, then pixel readout speed increases, but heat generation increases leading to potential failures
Solution Approach 1:
The patent converts the harmful effect of heat generation into a beneficial thermal management strategy. The air duct structure is designed to actively utilize the temperature gradient created by high-performance operation, conducting heat away from the image sensor through laterally extending ducts. By positioning ducts in regions of lower thermal mass and providing direct lateral pathways to the housing periphery, the system transforms the heat problem into an opportunity for efficient thermal management that enables sustained high-performance operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively releases heat from the image sensor while preventing an increase in size, ensuring safety and maintaining device performance by utilizing the air circulation conduit system to manage heat efficiently.
Implementation Method 1
a metallic plate 60 that is thermally connected to the image sensor 50
Implementation Method 2
an air circulation conduit 31 that is not communicated with an inside of the housing 30
Data Source
Figure 1A~1C
Figure 2
Figure 3
AI summary
An image capturing apparatus (100 Fig 3) according to an aspect of the present invention includes an air circulation conduit 31 that is not communicated with an inside of a housing 30 and is provided between a lens mount portion (10, Fig. 1A) and an image sensor (Fig 3, 50) in an optical axis direction, and a metallic plate (Fig. 3, 60) located on a facing surface of the image sensor.