Image Sensor EMC Shield Same-Side Contact Layout
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Solution Overview
Problem
Existing image sensor manufacturing processes face challenges in electromagnetic compatibility (EMC) shielding, requiring multiple orientation changes and additional process steps to connect conductive leads and ground contacts, leading to increased time and costs, especially in mass production.
Innovation Solution
An image sensor device design where the EMC shield is integrated with the housing, allowing conductive leads and a reference conductive lead to be connected on the same side of the substrate, maintaining consistent orientation during manufacturing, and using a conductive baffle with an aluminum film and anti-reflective coating for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive leads are connected to contacts on opposite sides of the substrate, then EMC shielding is achieved, but manufacturing complexity increases due to multiple orientation changes
Solution Approach 1:
The patent relocates all contacts (including ground contacts) to the same side of the substrate, fundamentally changing the spatial arrangement from opposite sides to same side. This dimensional reorganization eliminates the need for substrate flipping while maintaining EMC shielding effectiveness through the same conductive barrier structure.
Solution Approach 2:
The patent combines the ground contact function with the signal contact function by placing both on the same side of the substrate. This merging of functions into a single location eliminates the need for separate orientation steps, reducing manufacturing complexity while preserving electromagnetic compatibility shielding.
2Manufacturing precision
If multiple orientation changes are performed during manufacturing, then complete connections are achieved, but production time increases
Solution Approach 1:
The patent performs preliminary arrangement of all contacts on the same side of the substrate before the manufacturing assembly process begins. This preliminary spatial configuration ensures that all connections can be made in a single orientation, eliminating subsequent time-consuming reorientation steps while maintaining connection accuracy.
3Ease of manufacture
If substrate orientation is changed during assembly, then all contacts can be connected, but production cost increases
Solution Approach 1:
The patent redesigns the contact layout to place all contacts on the same side of the substrate, changing the spatial dimension of contact arrangement. This enables continuous assembly in a single orientation, dramatically improving mass production efficiency and reducing costs associated with repeated substrate handling and reorientation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process by maintaining consistent orientation, reducing time and costs, while providing effective electromagnetic shielding for image sensors, enhancing EMC performance without additional process complexity.
Implementation Method 1
Electromagnetic shielding limits the flow of electromagnetic fields between two locations, by separating them with a barrier made of conductive material
Implementation Method 2
Shielding can reduce the coupling of electromagnetic fields. The amount of reduction depends upon the material used, its thickness, and the frequency of the fields of interest
Data Source
AI summary
An image sensor device includes a base having a rectangular shape and comprising first contacts and a reference voltage contact extending along a first side thereof, a housing carried by the base, and an image sensor integrated circuit (IC) carried by the base within the housing and having an image sensing surface. A focus cell is within the housing, aligned with the image sensing surface, and includes second contacts. An electromagnetic compatibility (EMC) shield is carried by the housing and includes a top panel having an opening therein aligned with the focus cell, and side panels extending downwardly from the top panel. Conductive leads extend between one of the first contacts and a corresponding one of the second contacts. A reference conductive lead extends between the reference voltage contact and the EMC shield.