Image Sensor Encapsulation with Light Shielding and Dust Protection
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Solution Overview
Problem
Image sensor chips are prone to pollution from dust and contaminants in the environment before being mounted in a lens module, which affects their performance.
Innovation Solution
A chip encapsulation structure that includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion with a light shielding layer, where the protecting sheet acts as an infrared cut-off filter and dust protector, and the package portion is formed using a molding process to create a light shielding layer that absorbs stray light and prevents ghosting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the image sensor chip is exposed to the environment before lens module assembly, then the manufacturing process is simplified, but the chip becomes polluted by dust and contaminants
Solution Approach 1:
A protecting sheet is pre-installed on the image sensor chip before mounting it on the printed circuit board. This protecting sheet serves as a dust cover during the manufacturing process, preventing contamination while allowing the chip to be exposed to the environment for assembly operations. The protecting sheet is subsequently removed after the lens module is assembled.
2Reliability
If additional light-absorbing coatings are applied to prevent ghosting, then optical performance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
A light shielding layer is formed at specific locations within the package portion, particularly at the periphery and in areas where stray light would cause ghosting. This localized approach to light shielding provides the necessary optical performance improvement without requiring complete coating of the entire chip or package, thereby reducing manufacturing complexity.
Solution Approach 2:
The light shielding layer is integrated into the package portion structure itself, combining the packaging function with the light shielding function. This eliminates the need for separate light-absorbing coatings and reduces the number of manufacturing steps while achieving the same optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the image sensor chip from dust and contaminants, enhances the camera device's optical performance by reducing ghosting, and reduces production costs by eliminating the need for additional light-absorbing coatings.
Implementation Method 1
a protecting sheet, and a package portion with a light shielding layer, where the protecting sheet acts as an infrared cut-off filter
Implementation Method 2
the package portion is formed using a molding process to create a light shielding layer that absorbs stray light and prevents ghosting
Data Source
AI summary
An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.