Solid-State Image Sensor Fan-Out Packaging for Higher Terminal Density
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Solution Overview
Problem
There is a demand for higher performance and higher speed semiconductor packages for image sensors, which requires an increase in the number of terminals while maintaining a compact size.
Innovation Solution
A solid-state imaging unit is designed with an image sensor substrate, a glass substrate, and through electrodes that penetrate an adhesive resin to couple wiring lines and external terminals, allowing for a Fan-out package structure with increased terminal count and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If Fan-in structure with terminals on lower surface of image sensor chip is used, then package size is reduced, but the number of terminals is limited
Solution Approach 1:
The patent transitions from Fan-in structure (terminals on lower surface) to Fan-out structure (terminals on upper surface outside chip area). This dimensional change allows terminals to be positioned in the plane direction outside the image sensor substrate, enabling increased terminal count without increasing package footprint area.
Solution Approach 2:
The patent separates the terminal region from the image sensor active area by positioning external terminals outside the image sensor substrate boundaries. This segmentation allows independent optimization of sensor area and terminal area, enabling high terminal density without compromising sensor performance or increasing overall package size.
2Quantity of substance
If Fan-out structure with terminals outside chip is used, then number of terminals is increased, but package complexity increases
Solution Approach 1:
The patent introduces a glass substrate as an intermediary carrier that holds both the image sensor chip and external terminals. This glass substrate acts as a mediator that simplifies the overall structure by providing a unified platform for mounting components, reducing the complexity that would otherwise arise from separate mounting structures.
Solution Approach 2:
The glass substrate serves multiple functions simultaneously: it acts as a mechanical support for the image sensor chip, a carrier for external terminals, a substrate for wiring lines, and a structural element for the entire package. This multi-functionality reduces the need for additional components, thereby simplifying the overall package structure despite the increased terminal count.
3Reliability
If through electrodes penetrating adhesive resin are used, then electrical coupling is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The adhesive resin serves a dual function: it provides mechanical bonding between the glass substrate and image sensor chip, and it acts as an insulating medium through which through electrodes can penetrate. The adhesive resin's self-aligning properties during bonding help position the through electrodes accurately, reducing the need for high-precision external alignment processes.
Data Source
AI summary
The present technology relates to a solid-state imaging unit that makes it possible to increase the number of terminals, a method of producing the same, and an electronic apparatus. A solid-state imaging unit includes: an image sensor substrate including a light receiving region in which pixels that each convert incoming light to an electric signal are arranged in a matrix; a solder ball; a glass substrate opposite the image sensor substrate and the solder ball; and a through electrode that couples a wiring line pattern and the solder ball to each other by penetrating a glass adhesive resin interposed between the wiring line pattern and the solder ball. The solder ball is disposed outside the image sensor substrate in a plane direction. The wiring line pattern being formed on the glass substrate. The present disclosure is applicable, for example, to a package and the like including the image sensor substrate.