Image Sensor Alignment Using Fiducial-Registered Connection Bodies
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Solution Overview
Problem
Current methods for aligning image sensors with faceplates require accurate placement and dimensioning of package carriers, which can be costly and complex, especially when tolerances in package locations are less exacting than those on image sensors, leading to suboptimal alignment of apertures with the image sensor's active imaging area.
Innovation Solution
The method involves applying uncured adhesive to a packaged device with connection bodies, such as spheres, precisely positioned relative to fiducial marks on the image sensor, and then curing the adhesive. These connection bodies are mated into corresponding holes in a faceplate, allowing for accurate alignment without requiring precise placement of the package carrier, thus simplifying the assembly process and improving alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment methods are used to align the packaged image sensor with the faceplate, then alignment accuracy is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Fiducial marks are pre-formed on the image sensor chip during the semiconductor manufacturing process, and connection bodies are pre-positioned on the package carrier at locations registered to these fiducial marks. This preliminary action eliminates the need for complex active alignment during final assembly, as the pre-positioned connection bodies provide direct mechanical registration features with the faceplate.
Solution Approach 2:
Connection bodies serve as intermediary elements between the packaged image sensor and the faceplate. These connection bodies are positioned on the package carrier and mechanically mate with corresponding features in the faceplate, providing a simple mechanical registration system that replaces complex active alignment procedures while maintaining alignment accuracy.
2Manufacturing precision
If precise placement of package carrier is required to achieve accurate alignment, then alignment accuracy is improved, but manufacturing cost and difficulty increase
Solution Approach 1:
Connection bodies act as intermediary registration features that are positioned on the package carrier at locations registered to the fiducial marks on the image sensor. These connection bodies mechanically mate with corresponding features in the faceplate, providing accurate alignment without requiring precise placement of the entire package carrier during assembly.
Solution Approach 2:
The patent replaces complex mechanical active alignment systems with a simpler mechanical registration system using fiducial marks and connection bodies. Instead of using operational imaging to determine alignment, the system uses pre-positioned mechanical features that directly register the package carrier to the faceplate, significantly simplifying the manufacturing process.
3Ease of manufacture
If tolerances in package locations are less exacting than on image sensors, then ease of manufacture is improved, but alignment accuracy of apertures with image sensor deteriorates
Solution Approach 1:
Connection bodies serve as intermediary elements that bridge the tolerance gap between the package carrier and the image sensor. By positioning connection bodies on the package carrier at locations registered to the fiducial marks, and having these connection bodies mate with precise features in the faceplate, the system maintains alignment accuracy even when package carrier tolerances are less exacting than image sensor tolerances.
Solution Approach 2:
The alignment system is segmented into distinct functional elements: fiducial marks on the image sensor, connection bodies on the package carrier, and corresponding features in the faceplate. This segmentation allows each element to be manufactured with appropriate tolerances independently, with the connection bodies serving as the interface that maintains overall alignment accuracy despite variations in package carrier precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the alignment process, reduces the need for precise carrier dimensioning, and enhances the accuracy of aligning the aperture through the faceplate with the image sensor, enabling easier assembly and improved image sensor performance by ensuring better mechanical alignment, which in turn improves software stitching of images from multiple sensors.
Implementation Method 1
applying uncured adhesive to a portion of a first packaged device, then placing a first connection body on the uncured adhesive
Implementation Method 2
fiducial marks are formed in the chip that are precisely positioned relative to an optically active portion of the image sensor
Data Source
AI summary
An assembly includes a first packaged device that contains a first image sensor having first fiducial marks thereon. On a portion of the first packaged device at a predetermined location relative to the first fiducial marks is adhesive, and a first connection body is fixed within the adhesive and registered at the predetermined location relative to the first fiducial marks. The first connection body is mated into the first counter hole formed in a plate at a predetermined location.