Image Sensor Package Layout With Filter Glass Redistribution
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Solution Overview
Problem
Existing image sensor packages have large form factors and complex manufacturing processes, which hinder their integration into compact devices and increase production costs.
Innovation Solution
A novel image sensor package design featuring a package base substrate with a cavity, an image sensor chip, and a filter glass with redistribution patterns, connected via connection terminals and encapsulated by a dam structure, which reduces the overall thickness and simplifies electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional image sensor package structures are used, then electrical connections are established, but the form factor becomes large and manufacturing process becomes complex
Solution Approach 1:
The patent merges the filter glass and connection terminals into a single integrated component. The connection terminals are directly formed on the filter glass, eliminating the need for separate connection structures and reducing the number of assembly steps. This integration directly reduces both package size and manufacturing complexity.
Solution Approach 2:
The patent transitions from planar connections to three-dimensional vertical connections by forming connection terminals that extend through the filter glass thickness. This vertical arrangement allows electrical connections to be made in the thickness direction, reducing the lateral footprint and enabling a smaller package form factor.
2Ease of manufacture
If multiple separate components are used for filtering and connection, then electrical connections are established, but the number of manufacturing steps increases
Solution Approach 1:
The filter glass and connection terminals are manufactured as a single integrated component rather than separate parts. This merging reduces the number of assembly steps, improves manufacturing simplicity, and increases production efficiency by eliminating intermediate handling and alignment operations.
Solution Approach 2:
The connection terminals are pre-formed on the filter glass during the filter glass manufacturing process itself, rather than being added as a separate subsequent step. This preliminary action integrates the connection formation into the existing manufacturing flow, simplifying the overall process and improving productivity.
Data Source
AI summary
An image sensor package includes: a package base substrate having a cavity extending inwards from an upper surface thereof, and including a plurality of upper surface connection pads and a plurality of lower surface connection pads; an image sensor chip in the cavity, and including a chip body having a first surface and a second surface facing each other, a sensor unit located in the first surface of the chip body, and a plurality of chip pads around the sensor unit; a filter glass above the image sensor chip, and including a transparent substrate and a plurality of redistribution patterns on a lower surface of the transparent substrate; and a plurality of connection terminals between the plurality of redistribution patterns and the plurality of chip pads and between the plurality of redistribution patterns and the plurality of upper surface connection pads.