Solid-State Image Sensor Layout to Suppress Peripheral Light Flare
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Diagonal incident light entering the peripheral circuit region of a solid-state imaging element can reflect and enter the effective pixel region, causing flares due to the presence of a light-shielding film, which existing technologies fail to adequately prevent.
Innovation Solution
A solid-state imaging element design featuring a rib structure within the peripheral circuit region where no light-shielding film is formed in the same layer as the pixel-to-pixel light-shielding film, preventing diagonal light from entering the effective pixel region and reducing flare occurrence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light-shielding film is formed in the peripheral circuit section to prevent incident light from entering peripheral circuitry, then light shielding performance is improved, but diagonal incident light reflects off the light-shielding film and enters the effective pixel region again, causing flares
Solution Approach 1:
The patent extracts the light-shielding film from the region under the rib structure. By removing the light-shielding film only in the region where the rib structure is formed, the patent prevents diagonal light reflection while maintaining light shielding in other peripheral circuit regions. This selective removal resolves the contradiction between light shielding and flare prevention.
Solution Approach 2:
The patent applies different light shielding configurations to different regions: light-shielding film is present in most peripheral circuit regions but absent in the specific region under the rib structure. This local differentiation allows the patent to prevent flares from diagonal incident light while maintaining necessary light shielding elsewhere, resolving the contradiction through spatially varying properties.
2Object-generated harmful factors
If no light-shielding film is formed in the region under the rib structure to prevent flare, then flare occurrence is reduced, but light shielding performance in the peripheral circuit region may be compromised
Solution Approach 1:
The patent segments the peripheral circuit region into two sub-regions: one with light-shielding film (for light shielding) and one without light-shielding film under the rib structure (for flare prevention). This segmentation allows simultaneous achievement of both light shielding and flare reduction by assigning different functions to different segments.
Solution Approach 2:
The rib structure acts as an intermediary element that defines the region where no light-shielding film is formed. The presence of the rib structure mediates between the conflicting requirements of light shielding and flare prevention, creating a spatial zone where flare prevention takes priority while other areas maintain light shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the occurrence of flares by absorbing or redirecting diagonal light, enhancing image quality by minimizing light interference in the pixel region.
Implementation Method 1
This design effectively suppresses the occurrence of flares by absorbing or redirecting diagonal light
Data Source
AI summary
The present technology relates to a solid-state imaging element, a solid-state imaging element package, and electronic equipment that can suppress occurrence of flares. The solid-state imaging element includes an effective pixel region and a peripheral circuit region. The effective pixel region includes a plurality of pixels arranged two-dimensionally in a matrix pattern. The peripheral circuit region is provided around the effective pixel region. The effective pixel region has a pixel-to-pixel light-shielding film formed at boundary portions between the pixels. In a region on a substrate where a rib structure is formed within the peripheral circuit region, no light-shielding film is formed in the same layer as the pixel-to-pixel light-shielding film. The present technology is applicable, for example, to a solid-state imaging element package including a cover glass that protects a light-receiving surface of the solid-state imaging element.