Image Sensor Package Lid Assembly for Bond Pad Flare Reduction

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Solution Overview

Problem

Existing image sensor packages face issues with electromagnetic radiation flare due to reflection from bond pads and the need for separate optically opaque masks, which complicates the manufacturing process and reduces throughput.

Innovation Solution

An image sensor package design incorporating an optically opaque film adhesive that covers bond pads and extends through bond wires, bonded to an optically transmissive lid, eliminating the need for separate masks and reducing flare by preventing radiation reflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If separate optically opaque masks are used to prevent electromagnetic radiation flare, then flare reduction is achieved, but device complexity and manufacturing process complexity increase

Engineering Contradiction:

Improveelectromagnetic radiation flareVSAvoidmanufacturing process complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines the optically opaque mask function with the adhesive layer used to bond the lid to the sensor die. The adhesive is formulated to be optically opaque and is applied in a pattern that covers the bond pads, thereby eliminating the need for a separate mask layer and reducing manufacturing complexity while still preventing electromagnetic radiation flare.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The adhesive layer performs multiple functions: it bonds the lid to the sensor die, provides optical opacity to prevent flare from bond pads, and serves as a structural component of the package. This multi-functionality eliminates the need for separate optically opaque mask materials and simplifies the overall device structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Object-affected harmful factors

If separate optically opaque masks are used to prevent electromagnetic radiation flare, then flare reduction is achieved, but manufacturing throughput decreases

Engineering Contradiction:

Improveelectromagnetic radiation flareVSAvoidmanufacturing throughput

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The optically opaque properties are built into the adhesive material itself before the bonding process. This preliminary incorporation of the optical shielding function into the adhesive eliminates the need for subsequent mask application steps, thereby improving manufacturing throughput without sacrificing flare reduction capability.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If bond pads are exposed, then electrical connectivity is maintained, but electromagnetic radiation reflection increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidelectromagnetic radiation reflection

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The adhesive is applied in a specific pattern that covers only the bond pads and surrounding areas where electromagnetic radiation reflection is problematic, while leaving the active sensor areas exposed. This localized application provides optical shielding exactly where needed without interfering with the electrical connectivity function of the bond pads.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The optically opaque adhesive serves as an intermediary layer between the bond pads and the external environment. It blocks electromagnetic radiation from reflecting off the bond pads while allowing the bond pads to maintain their electrical connectivity function, effectively mediating between optical shielding requirements and electrical functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces electromagnetic radiation flare and simplifies the manufacturing process by integrating the adhesive into the lid assembly, improving throughput and performance.

Implementation Method 1

an optically opaque film adhesive over the at least one bond pad

Methodology Applied

Scientific EffectOptical absorption: Absorption (EM radiation)

Implementation Method 2

a bond wire wirebonded to the at least one bond pad; The bond wire may extend through the optically opaque film adhesive to the at least one bond pad

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

an optically transmissive lid coupled to the image sensor die

Methodology Applied

Scientific EffectOptical transmission:

Data Source

PatentUS12532559B2Image sensor packaging structures and related methods

Publication Date: 2026.01.20 SEMICON COMPONENTS IND LLC

AI summary

Implementations of an image sensor package may include an image sensor die including at least one bond pad thereon; a bond wire wirebonded to the at least one bond pad; and an optically transmissive lid coupled to the image sensor die with an optically opaque film adhesive over the at least one bond pad. The bond wire may extend through the optically opaque film adhesive to the at least one bond pad.