Image Sensor Module Front-Side Connecting Reduces Size
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Solution Overview
Problem
Conventional image sensor modules are oversized due to the placement of connecting members opposite the top surface of the semiconductor chip, making them unsuitable for structures with circuit substrates on the opposite side, and are difficult to miniaturize.
Innovation Solution
The image sensor module is redesigned with photodiode units in an active region, pads in a peripheral region, and re-distribution layers extending to a connecting region, covered by a transparent substrate with exposed connecting layers on the top surface, and connecting members attached to these layers, allowing for a reduced size and modified structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connecting member is disposed at the position opposite to the top surface of the semiconductor chip, then the electrical connection to external circuit substrate is achieved, but the size of the image sensor module is considerably increased
Solution Approach 1:
The patent inverts the conventional arrangement by disposing the connecting member on the same side as the top surface of the semiconductor chip (front side mounting) instead of the opposite side (back side mounting). This inversion allows the connecting member to be positioned above the semiconductor chip, enabling electrical connection while reducing the overall module size and allowing circuit substrate to be disposed at the position opposite to the top surface.
Solution Approach 2:
The patent utilizes the vertical dimension by extending re-distribution layers through the semiconductor chip from the bottom surface to the top surface, and positioning the connecting member above the chip. This three-dimensional arrangement allows electrical connections to be made in the vertical direction rather than requiring lateral extension, thereby reducing the module's horizontal footprint.
2Adaptability or versatility
If the connecting member is disposed at the position opposite to the top surface of the semiconductor chip, then the conventional structure is maintained, but it is difficult to apply the module to structures with circuit substrate at the opposite position
Solution Approach 1:
By inverting the connecting member position to the front side (same side as top surface), the patent enables the back side (opposite position) to be available for circuit substrate integration, thus improving adaptability to modern module structures where circuit substrates are positioned behind the sensor chip.
Solution Approach 2:
The patent segments the electrical connection path into multiple components: pads on the bottom surface, re-distribution layers extending through the chip, and connecting members on the top surface. This segmentation allows independent optimization of each component's position and function, enabling greater structural flexibility and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the image sensor module, enabling its application in structures with circuit substrates on the opposite side of the semiconductor chip, while maintaining functionality.
Implementation Method 1
photodiode units disposed in an active region to convert light into electric signals
Data Source
AI summary
An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.