Solid-state image sensor grid height variation

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Solution Overview

Problem

Traditional solid-state image sensors with constant grid heights suffer from diffraction issues and crosstalk between color filter layers, leading to petal flares and image quality degradation.

Innovation Solution

Incorporating grid structures with different heights between color filter layers to prevent diffraction and improve image signal quality, specifically using a first grid structure with a higher height and a second grid structure with a lower height to minimize light interference and crosstalk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a constant grid height structure is used to separate color filter layers, then the grid structure can be manufactured with simple process, but it causes diffraction of light into several beams travelling in different directions, resulting in petal flares and image quality degradation

Engineering Contradiction:
Improvegrid structure manufacturing simplicityVSAvoiddiffraction and petal flares
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by varying the grid height at different locations. Specifically, the grid structure includes first grids with a first height and second grids with a second height that is different from the first height. This local variation in grid height prevents uniform diffraction patterns while maintaining the color filter separation function, thereby reducing petal flares without complicating the overall manufacturing process.

Inventive Principle:
Principle #3Local quality

2Device complexity

If a general grid structure with constant height is used, then the device complexity is low, but crosstalk between different color filter layers occurs, degrading image signal quality

Engineering Contradiction:
Improvegrid structure complexityVSAvoidimage signal quality and crosstalk prevention
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent implements local quality by assigning different heights to different grid regions. The first grids have a first height and the second grids have a second height, creating localized variations that prevent crosstalk between color filter layers. This approach maintains relatively low device complexity while significantly improving image signal quality by eliminating inter-layer interference.

Inventive Principle:
Principle #3Local quality

3Reliability

If different grid heights are used to prevent diffraction and crosstalk, then image signal quality is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveimage signal qualityVSAvoidgrid structure manufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the grid structure into distinct first grids and second grids with different heights. This segmentation allows for modular manufacturing where different grid regions can be formed using standardized processes, reducing the overall manufacturing complexity despite the height variations. The segmented approach enables systematic production while achieving the desired image signal quality improvement.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the quality of the image signal by reducing diffraction and crosstalk, resulting in improved image capture and reduced petal flares in solid-state image sensors.

Implementation Method 1

general grid structure has a constant grid height, which may split and diffract light into several beams travelling in different directions (like a diffraction grating), thereby causing petal flares in the obtained image

Methodology Applied
Scientific EffectDiffraction: Diffraction

Data Source

PatentUS11631709B2Solid-state image sensor
Publication Date: 2023.04.18 VISERA TECH CO LTD
  • US11631709B2 patent drawing
  • US11631709B2 patent drawing
  • US11631709B2 patent drawing

AI summary

A solid-state image sensor is provided. The solid-state image sensor includes a plurality of photoelectric conversion elements. The solid-state image sensor also includes a first color filter layer disposed above the photoelectric conversion elements and having a plurality of first color filter segments. The solid-state image sensor further includes a second color filter layer disposed adjacent to the first color filter layer and having a plurality of second color filter segments. The solid-state image sensor includes a first grid structure disposed between the first color filter layer and the second color filter layer. The first grid structure has a first grid height. The solid-state image sensor also includes a second grid structure disposed between the first color filter segments and between the second color filter segments. The second grid structure has a second grid height that is lower than or equal to the first grid height.