Image Sensor Heat Sink Layout for Slim Autofocus Cameras

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Solution Overview

Problem

Conventional voice coil motor (VCM) technology is difficult to apply to micro-scale camera devices requiring low power consumption, and there is a need for improved heat dissipation and reduced height in the optical-axis direction to support high-resolution cellular phone cameras with auto-focusing, shutter stabilization, and zooming capabilities.

Innovation Solution

A camera device design featuring a moving unit with a first heat dissipation member and an image sensor, a fixed unit with a second heat dissipation member spaced apart and overlapping in the optical-axis direction, and a support member to facilitate movement perpendicular to the optical-axis, utilizing metal plates with grooves for enhanced heat dissipation and reduced height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional VCM technology is used in camera devices, then auto-focusing function can be achieved, but it is difficult to apply to micro-scale camera devices requiring low power consumption

Engineering Contradiction:

Improveadaptability to micro-scale camera devicesVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent replaces the conventional voice coil motor (electromagnetic actuation) with a piezoelectric actuator that utilizes piezoelectric effect for mechanical displacement. This substitution enables micro-scale camera devices to achieve auto-focusing with lower power consumption and更适合微型化设计

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the actuation mechanism from electromagnetic to piezoelectric, fundamentally altering the physical principle and operational parameters. This enables the system to operate at micro-scale with reduced power consumption while maintaining auto-focusing capability

Inventive Principle:

Principle #35Parameter changes

2Temperature

If heat dissipation structures are added to the camera device, then heat dissipation efficiency is improved, but the height in optical-axis direction increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheight in optical-axis direction

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

The patent transitions heat dissipation from a vertical arrangement (increasing optical-axis height) to a planar arrangement on the circuit board. The first and second heat dissipation members are disposed on the same plane, utilizing horizontal space instead of vertical space, thus maintaining compact height while achieving effective heat dissipation through thermal conduction across the board surface

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation members are integrated within the existing circuit board structure, with the first heat dissipation member positioned at a first location and the second heat dissipation member at a second location on the board, nesting the thermal management function within the structural framework without adding external height

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves heat dissipation, inhibits temperature increase, reduces noise and image sensor deterioration, and maintains auto-focusing reliability while minimizing the device's height in the optical-axis direction.

Implementation Method 1

a first heat dissipation member, a first board disposed on the first heat dissipation member and including a hole to expose a portion of the first heat dissipation member, and an image sensor disposed in the hole... a second heat dissipation member disposed on the second board... The image sensor is coupled to the first heat dissipation member

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12574617B2Camera device and optical instrument

Publication Date: 2026.03.10 LG INNOTEK CO LTD

AI summary

A camera device of the disclosure includes a moving unit, including a first heat dissipation member, a first board disposed on the first heat dissipation member and including a hole to expose a portion of the first heat dissipation member, and an image sensor disposed in the hole, a fixed unit, including a second board disposed so as to be spaced apart from the first heat dissipation member and a second heat dissipation member disposed on the second board, and a support member, configured to support the moving unit to move relative to the fixed unit in a direction perpendicular to an optical-axis direction. The image sensor is coupled to the first heat dissipation member, and the second heat dissipation member is disposed so as to be spaced apart from the first heat dissipation member and to overlap the first heat dissipation member in the optical-axis direction.