Image Sensor Module Inverted Mounting Heat Dissipation
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Solution Overview
Problem
Conventional image sensor modules have increased thickness due to the adherence of image sensor packages on module substrates, which hinders miniaturization and lacks effective heat dissipation, making them unsuitable for thin digital devices.
Innovation Solution
An image sensor module design where the image sensor package is adhered to the lower surface of a circuit board with a window, allowing the image sensor chip to be exposed, and incorporating a heat-dissipating substrate and optical system on the upper surface, along with a heat-dissipating plate for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the image sensor package is adhered on the module substrate, then the image sensor module can be assembled, but the total thickness of the image sensor module is increased
Solution Approach 1:
The patent inverts the conventional mounting approach by adhering the image sensor package to the lower surface of the circuit board instead of the upper surface. This inversion allows the image sensor chip to be exposed through a window on the upper surface, eliminating the need for additional packaging thickness and achieving a thinner overall module while maintaining assembly capability
Solution Approach 2:
The patent transitions from a conventional planar mounting arrangement to a three-dimensional configuration where the image sensor package extends through the circuit board thickness. By utilizing the vertical dimension and exposing the image sensor chip through a window, the design achieves compactness in the thickness direction while maintaining functional connectivity
2Stability of the object's composition
If the image sensor package is adhered on the module substrate, then the module structure is stable, but the heat dissipation performance is insufficient
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional package structure and implements it through a dedicated heat-dissipating substrate and heat-dissipating plate. The image sensor package is adhered to the lower surface with thermal contact to the heat-dissipating substrate, which extends through the circuit board to provide efficient thermal pathways separate from the mechanical support structure
Solution Approach 2:
The patent employs composite material structures including a heat-dissipating substrate made of thermally conductive material (such as metal core substrate) combined with the circuit board. The heat-dissipating plate adhered to the lower surface creates a composite thermal management system that maintains structural stability while providing superior heat dissipation pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall height of the image sensor module, enabling thinner digital devices while enhancing heat dissipation performance, thus addressing the thickness and heat management issues of conventional modules.
Implementation Method 1
the mounting substrate of the image sensor package may include a heat-dissipating substrate and a circuit substrate provided on the heat-dissipating substrate
Implementation Method 2
The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip
Implementation Method 3
the image sensor chip may be adhered to an upper surface of the mounting substrate by an adhesive layer
Data Source
AI summary
An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.