Image Sensor Lamination for Flexible Pixel Configurations
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Solution Overview
Problem
The high manufacturing cost of image-capturing elements with varying pixel numbers due to the need for dedicated pixel and pixel readout circuit designs, as well as custom masks, limits flexibility and efficiency in producing image-capturing elements with different pixel configurations.
Innovation Solution
A method involving the lamination of a substrate with two-dimensionally arrayed pixels and a substrate with circuit blocks, where the circuit blocks are electrically independent and have connection terminals to a power supply and reference potential, allowing for the formation of laminate image-capturing elements with adjustable pixel and circuit configurations, enabling the production of image-capturing elements with varying pixel numbers and sizes without the need for custom masks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dedicated pixels and pixel readout circuits are designed for different pixel numbers, then image-capturing elements can be manufactured with specific pixel configurations, but manufacturing cost increases due to custom masks and dedicated designs
Solution Approach 1:
The patent applies universality by designing a single substrate structure that can serve multiple pixel configurations. The substrate is divided into multiple regions with pixels arranged in different patterns (e.g., first region with first pixel arrangement, second region with second pixel arrangement), allowing the same substrate to produce image-capturing elements with different effective pixel numbers by selectively activating different regions or combining regions in different ways.
Solution Approach 2:
The substrate is segmented into multiple independent regions, each capable of functioning as a complete pixel array. This segmentation allows flexible combination of regions to achieve different pixel configurations without requiring separate substrates or custom masks for each configuration.
2Adaptability or versatility
If custom masks are used for each pixel configuration, then image-capturing elements with specific pixel numbers can be produced, but manufacturing complexity and cost increase
Solution Approach 1:
A single mask design is used to fabricate the entire substrate with multiple pixel arrangements integrated. The mask creates a universal substrate structure that can be configured into different pixel numbers through selective region activation rather than requiring separate custom masks for each pixel configuration.
Solution Approach 2:
The patent introduces dynamic configurability where the effective pixel arrangement can be changed after manufacturing by selectively activating or deactivating different substrate regions. This dynamic approach replaces static custom mask designs with a flexible post-manufacturing configuration capability.
3Ease of manufacture
If a single substrate with uniform pixel arrangement is used, then manufacturing is simplified, but flexibility to produce image-capturing elements with different pixel numbers is reduced
Solution Approach 1:
Different regions of the substrate are designed with different pixel arrangements and characteristics (local quality variations). The first region has a first pixel arrangement while the second region has a second pixel arrangement, allowing each region to be optimized for specific purposes while maintaining overall manufacturing simplicity through a single substrate fabrication process.
Data Source
AI summary
An image-capturing element manufacturing method includes: preparing a first substrate having a plurality of pixels that are two-dimensionally continuously arrayed; preparing a second substrate having a plurality of circuit blocks that respectively have connection terminals to a power supply and a reference potential and that are electrically independent from each other, each of the plurality of circuit blocks having at least some of circuits to read out signals from the plurality of pixels; laminating the first substrate and the second substrate to electrically couple the plurality of circuit blocks and the plurality of pixels overlapping therewith; and cutting circuit blocks around at least one of the plurality of circuit blocks and pixels overlapping therewith to form a laminate in which the plurality of pixels are laminated onto the at least one of the plurality of circuit blocks.