Image Sensor Package Laser Bonding for Wire-Free Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image sensor packages face challenges in miniaturization, low power consumption, multi-functionality, high-speed signal processing, high reliability, and cost-effectiveness while maintaining clear picture quality as consumer and industrial demands increase.
Innovation Solution
A method of manufacturing an image sensor package involves forming a redistribution pattern and insulating film on a device wafer, creating an external connection terminal, and using a laser bonding process to integrate a transparent substrate with a dam pattern, followed by a singulation process to form individual packages, eliminating the need for bonding wires and reducing package volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing manufacturing methods are used for image sensor packages, then the package can be produced with standard processes, but the package size cannot be sufficiently reduced and reliability is compromised
Solution Approach 1:
The patent extracts and eliminates the encapsulation material from the package structure, replacing it with a transparent substrate that directly bonds to the chip. This removal of unnecessary components reduces package volume while improving reliability by eliminating interfaces that could fail.
Solution Approach 2:
The patent merges the substrate and chip into a directly bonded structure, eliminating the encapsulation layer between them. This integration reduces the overall package volume and improves reliability by reducing the number of bonding interfaces and potential failure points.
2Volume of moving object
If the package size is reduced for miniaturization, then smaller products can be achieved, but signal transmission speed may be affected and manufacturing complexity increases
Solution Approach 1:
The patent transitions to a vertical stacking architecture where the substrate bonds directly to the chip in a face-to-face configuration. This dimensional reorganization shortens signal transmission paths and improves speed while reducing package volume, as components are arranged in three-dimensional space rather than spread out horizontally.
3Reliability
If encapsulation material is used to protect the chip, then reliability is improved, but package volume increases and manufacturing complexity increases
Solution Approach 1:
The patent removes the encapsulation material entirely and replaces it with a transparent substrate that serves both as a protective cover and as a functional component. This elimination simplifies the manufacturing process by reducing the number of materials and steps required, while maintaining chip protection through the direct bonding structure.
4Reliability
If additional space is allocated for bonding wires, then connection reliability is improved, but package volume increases
Solution Approach 1:
The patent adopts a vertical stacking architecture where the substrate bonds directly to the chip in a face-to-face configuration. This dimensional reorganization eliminates the need for lateral bonding wire routing, as connections are made through direct vertical bonding interfaces, thereby reducing package volume while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves miniaturization and enhances reliability by eliminating the need for bonding wires, improving signal transmission speed, and reducing package size without compromising on picture quality.
Implementation Method 1
performing a laser bonding process of radiating a laser beam to the preliminary dam pattern
Implementation Method 2
adhering the preliminary dam pattern to the device wafer and the preliminary transparent substrate by performing a laser bonding process
Data Source
AI summary
Provided is a method of manufacturing an image sensor package, the method including preparing a device wafer including a plurality of chip portions and a scribe lane, forming a redistribution insulating film on a lower surface of the device wafer to cover a redistribution pattern and a portion of the redistribution pattern and to cover a lower surface of the device wafer, forming a redistribution pattern on a lower surface of the device wafer and a redistribution insulating film to cover a portion of the redistribution pattern and to cover a lower surface of the device wafer, placing a preliminary transparent substrate on an upper surface of the device wafer on which the preliminary dam pattern is formed, performing a laser bonding process of radiating a laser beam to the preliminary dam pattern, and performing a singulation process forming individual image sensor packages.