Image Sensor Lens Holder Protection Layer
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Solution Overview
Problem
Conventional image sensor modules face increased manufacturing costs and size due to the flow of adhered layers, which compromises product reliability by potentially reaching the sensor region of the chip.
Innovation Solution
Incorporating a protection layer with a lateral wall and internal thread on the lens holder, adhered to the substrate to encapsulate the chip, preventing the adhered layer from reaching the sensor region, and using a lens barrel with external threads for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhered layer is coated on the substrate to encapsulate the chip, then the chip is protected and assembled, but the adhered layer flows out of the lens holder increasing module size and potentially reaching the sensor region
Solution Approach 1:
The protection layer is introduced as an intermediary component between the adhered layer and the sensor region. This protection layer receives the flowing adhered layer, preventing it from reaching the sensor region, while also containing the adhered layer within acceptable boundaries to control module size.
2Reliability
If the adhered layer is coated on the substrate to encapsulate the chip, then the chip is protected and assembled, but the adhered layer flows out of the lens holder increasing manufacturing complexity
Solution Approach 1:
The protection layer is integrated with the lens holder structure, merging two components into a unified design. This integration simplifies the manufacturing process by reducing the number of separate assembly steps while still providing the necessary protection against adhered layer flow.
3Ease of manufacture
If no protection layer is used, then the manufacturing process is simpler and smaller, but the adhered layer can reach the sensor region decreasing product reliability
Solution Approach 1:
The protection layer is implemented as a thin film structure that is conformally deposited on the lens holder. This thin film provides effective protection against adhered layer flow while adding minimal complexity to the manufacturing process, maintaining ease of manufacture while improving reliability.
Data Source
AI summary
An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.