Image Sensor Package Adhesive Layout for Light Blocking Reliability
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Solution Overview
Problem
Current semiconductor and image sensor packages face challenges in maintaining product reliability due to issues with light blocking and structural integrity, particularly in designs involving microlenses and transparent substrates.
Innovation Solution
The implementation of a semiconductor package design that includes a package substrate, a semiconductor or image sensor chip, a transparent substrate, and an adhesive layer configured to block light. The adhesive layer is strategically positioned between the chip and the transparent substrate, which has varying widths and protrusions to effectively block light and secure the transparent substrate, while also surrounding the microlenses to enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a transparent substrate is used to allow light to enter the image sensor chip, then light transmission is improved, but light blocking becomes problematic causing reduced product reliability
Solution Approach 1:
The transparent substrate is divided into different regions: a first region with a first width and a second region with a second width greater than the first width. This segmentation allows different portions of the substrate to serve different functions - the first region allows light transmission while the second region provides structural support and enables effective light blocking by the adhesive layer at the edges.
Solution Approach 2:
Different regions of the transparent substrate are designed with different widths to provide localized functions. The first region (narrower) optimizes light transmission to the microlenses, while the second region (wider) provides structural integrity and creates an effective boundary for light blocking by the adhesive layer, thus achieving local optimization of both optical and structural properties.
2Object-affected harmful factors
If the adhesive layer is positioned between the chip and transparent substrate to block light, then light blocking is improved, but structural integrity becomes compromised
Solution Approach 1:
The transparent substrate extends beyond the chip in width, creating a dimensional extension that allows the adhesive layer to effectively block light at the edges without compromising the central bonding structure. The wider second region provides additional structural support that compensates for the presence of the adhesive layer, maintaining overall structural integrity while achieving effective light blocking.
Solution Approach 2:
The adhesive layer serves as an intermediary that performs dual functions: it bonds the transparent substrate to the image sensor chip while simultaneously blocking light from reaching the chip edges. The strategic positioning and the extended substrate design work together to allow this intermediary element to fulfill both bonding and light blocking functions without compromising structural integrity.
3Object-affected harmful factors
If the transparent substrate has varying widths to effectively block light, then light blocking is improved, but device complexity increases
Solution Approach 1:
The transparent substrate is segmented into two distinct regions with different widths. This simple binary segmentation achieves effective light blocking without requiring complex multi-region designs. The first region (narrower) and second region (wider) create a straightforward geometric structure that is easy to manufacture while effectively preventing light leakage at the edges.
Solution Approach 2:
The varying width design applies local quality by making the substrate wider only where needed (the second region) for structural support and light blocking, while keeping the first region narrower to optimize light transmission. This localized modification avoids unnecessary complexity throughout the entire substrate, achieving effective light blocking with minimal design complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances product reliability by effectively blocking light and ensuring proper alignment and securement of the transparent substrate, thereby improving the overall structural integrity and functionality of the semiconductor and image sensor packages.
Implementation Method 1
an adhesive layer that is disposed between the semiconductor chip and the transparent substrate. The adhesive layer is configured to block light.
Data Source
AI summary
A semiconductor package includes: a package substrate; a semiconductor chip disposed on the package substrate; a transparent substrate disposed on the semiconductor chip; and an adhesive layer that is disposed between the semiconductor chip and the transparent substrate. The adhesive layer is configured to block light. The transparent substrate includes: a first lower side that faces the semiconductor chip, a second lower side that faces the semiconductor chip and that is disposed above the first lower side, and a first inner side wall that connects the first lower side and the second lower side, and the adhesive layer is in contact with the second lower side and the first inner side wall.