Image Sensor Metal Structure Tapered Sidewalls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current image sensors face challenges in miniaturization and high-resolution capabilities, particularly in integrating advanced features like organic photoelectric layers and efficient manufacturing processes.
Innovation Solution
The development of an image sensor design that includes a semiconductor substrate with a photoelectric transducer, a color filter layer, a metal structure, an insulating layer, and an organic photoelectric layer, along with a transparent electrode layer, which are carefully structured and processed to enhance miniaturization and resolution, using techniques like dual damascene methods and chemical mechanical polishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the image sensor structure is miniaturized to achieve high resolution, then the resolution capability is improved, but the manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent applies preliminary action by forming the metal structure with tapered sidewalls before depositing the color filter layer and insulating layer. This pre-established geometric configuration compensates for potential misalignments in subsequent manufacturing steps, ensuring that even when manufacturing precision deteriorates due to miniaturization, the final layered structure maintains proper alignment and functional performance.
2Reliability
If advanced features like organic photoelectric layers are integrated to improve performance, then the imaging capability is improved, but the device complexity increases
Solution Approach 1:
The patent segments the image sensor into distinct functional layers including the organic photoelectric layer, color filter layer, insulating layer, and metal structure. Each layer is independently formed and optimized, allowing advanced features like organic photoelectric materials to be integrated without overwhelming the overall device complexity. The segmentation enables modular manufacturing and simplifies the integration process for high-performance imaging components.
3Volume of moving object
If multiple layers are stacked to achieve miniaturization, then the volume is reduced, but the alignment precision becomes more difficult to maintain
Solution Approach 1:
The patent employs a nested doll approach by stacking multiple functional layers including the organic photoelectric layer, color filter layer, insulating layer, and metal structure in a vertically integrated configuration. The tapered sidewall design of the metal structure acts as a self-aligning feature that guides subsequent layers into proper registration, enabling miniaturization through vertical stacking while maintaining alignment precision through geometric constraints rather than relying solely on manufacturing accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved miniaturization and high-resolution imaging capabilities while ensuring reliable manufacturing processes, even in the presence of misalignment during photoresist layer formation, thereby enhancing the overall performance and reliability of the image sensor.
Implementation Method 1
a semiconductor substrate including a photoelectric transducer
Implementation Method 2
chemical mechanical polishing
Data Source
AI summary
Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.