Image Sensor Mount Assembly Stress-Reduced Soldering
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Solution Overview
Problem
Existing methods for manufacturing endoscope components with electronic circuits face challenges in miniaturization, as they struggle to efficiently connect pins and electronic components on a substrate while maintaining structural integrity and reducing stress on components.
Innovation Solution
A method and apparatus for manufacturing a mount assembly that aligns and connects pins and electronic components on a substrate using a mounting jig, applying heat and pressure with solder, ensuring the components' heights are proportionate and reducing unnecessary pressure on the electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pins and electronic components are connected to the same surface of a substrate using conventional methods, then the connection process becomes complex and time-consuming, but the manufacturing efficiency and productivity remain low
Solution Approach 1:
The patent merges the connection processes of pins and electronic components into a single simultaneous operation. The mounting apparatus applies heat and pressure uniformly across the entire array of pins and electronic components mounted on the substrate, enabling collective reflow soldering that connects both element types in one step rather than requiring separate sequential processes.
Solution Approach 2:
The patent employs preliminary arrangement where pins and electronic components are pre-positioned in a specific spatial configuration on the substrate before the connection process. The mounting apparatus is designed to accommodate this pre-arranged layout, with heating and pressing elements positioned to simultaneously contact all connection points, enabling efficient batch processing.
2Strength
If conventional mounting methods are used to connect pins and electronic components, then the structural integrity may be compromised, but the stress on electronic components increases causing potential damage
Solution Approach 1:
The patent applies local quality by designing the mounting apparatus to deliver differentiated pressure and heat distribution. The pressing elements are configured to apply appropriate force locally at each connection point while distributing the total load across the entire array, preventing excessive stress concentration on individual electronic components while ensuring adequate bonding pressure.
Solution Approach 2:
The patent utilizes parameter changes by controlling the temporal and spatial distribution of heat and pressure during the connection process. The heating element gradually increases temperature to melt solder, while the pressing element applies controlled pressure that is maintained throughout the reflow process, then gradually reduced, optimizing both bond strength and component protection.
3Reliability
If the heights of pins and electronic components are not proportionate, then the mounting process becomes difficult, but the manufacturing precision and reliability decrease
Solution Approach 1:
The patent addresses height variations by introducing a vertical dimension solution through adjustable mounting structures. The pressing elements are designed with adjustable heights or compliant mechanisms that can accommodate different component heights, applying pressure at the appropriate level for each element type while maintaining uniform heating across all connection points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and stress-reduced connection of pins and electronic components on a substrate, facilitating the miniaturization of endoscope components and enabling the production of smaller, more compact electronic assemblies.
Implementation Method 1
connecting the plurality of pins and the plurality of electronic components collectively to the surface of the substrate by applying heat and pressure
Implementation Method 2
solder applied to a land on the substrate and the connecting section of each of the plurality of pins are in contact with each other
Implementation Method 3
connecting the plurality of pins and the plurality of electronic components collectively to the surface of the substrate by applying heat and pressure
Data Source
AI summary
An imaging apparatus mount assembly for an image sensor chip includes a substrate, a plurality of first pins and at least one first electronic component, both mounted on a first surface of the substrate, and a first resin sealant configured to seal the first surface so as to expose an end face of a first shaft section opposite to where a first connecting section is provided. A plurality of second pins and at least one second electronic component are both mounted on a second surf ace of the substrate. A second resin sealant is configured to seal the second surface so as to expose an end face of a second shaft section opposite to where a second connecting section is provided. The image sensor chip includes a light receiving unit and a back-surface electrode, the first shaft section exposed on the first resin sealant is connected to the back-surface electrode.