Image Sensor Mounting Base With Recessed Substrate For Heat Dissipation
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Solution Overview
Problem
Existing image sensor mounting bases struggle to accommodate image sensors with different pixel numbers and characteristics while maintaining effective heat dissipation and electrical characteristics, leading to noise issues in imaging modules.
Innovation Solution
An image sensor mounting base with a substrate featuring multiple electrode pads and a recessed area for the second image sensor, allowing for different mounting configurations and improved heat dissipation by positioning the second image sensor closer to the substrate's bottom, where it can release heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two image sensors with different characteristics are mounted on the same substrate, then the imaging module achieves multifunctionality, but heat dissipation becomes difficult due to uniform mounting heights
Solution Approach 1:
The patent applies local quality by creating different mounting heights for different image sensors. The first image sensor is mounted on the upper surface of the substrate, while the second image sensor is mounted on the lower surface through a through-hole. This allows each sensor to have optimized heat dissipation characteristics according to its specific thermal requirements, resolving the contradiction between accommodating different sensor types and achieving effective heat dissipation for each.
2Device complexity
If image sensors are mounted at the same height on the substrate, then the mounting structure is simple, but electrical characteristics deteriorate due to noise interference
Solution Approach 1:
The patent transitions from a two-dimensional uniform mounting plane to a three-dimensional structure by mounting the first image sensor on the upper surface and the second image sensor on the lower surface through a through-hole. This vertical separation in the third dimension effectively isolates the electrical signals of different sensors, reducing noise interference and improving electrical characteristics while maintaining a relatively simple mounting structure.
3Adaptability or versatility
If image sensors with different pixel numbers are accommodated, then the imaging module meets diverse functional demands, but heat generation varies causing uniform cooling to be ineffective
Solution Approach 1:
The patent implements local quality by providing different mounting configurations for sensors with different thermal characteristics. Sensors generating more heat can be mounted on the lower surface where heat can be dissipated in a different direction, while sensors with lower heat generation remain on the upper surface. This localized optimization of heat dissipation paths improves overall energy efficiency by reducing the loss of heat energy that would otherwise interfere with image quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation and maintains electrical characteristics, reducing noise in images captured by the imaging module while accommodating image sensors with varying functionalities and heat generation levels.
Implementation Method 1
improved heat dissipation by positioning the second image sensor closer to the substrate's bottom, where it can release heat effectively
Data Source
AI summary
An image sensor mounting base includes a substrate, and a first, a second, a third and a fourth electrode pad. The substrate has an upper surface including a first mount area where a first image sensor is mountable, and a second mount area where a second image sensor is mountable. The second mount area is spaced from the first mount area. The first and second electrode pads are located on the upper surface of the substrate and across the first mount area each other. The third and fourth electrode pads on the upper surface of the substrate are spaced from the first electrode pad and the second electrode pad and face each other across the second mount area. The substrate has, on the upper surface, a recess between the third electrode pad and the fourth electrode pad. The second mount area is located on a bottom of the recess.